PACDN1408C California Micro Devices Corp, PACDN1408C Datasheet
PACDN1408C
Manufacturer Part Number
PACDN1408C
Description
ESD PROTECTION ARRAYS/ CHIP SCALE PACKAGE
Manufacturer
California Micro Devices Corp
Datasheets
1.PACDN1408C-R.pdf
(3 pages)
2.PACDN1408C.pdf
(3 pages)
3.PACDN1408C.pdf
(3 pages)
4.PACDN1408C.pdf
(3 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PACDN1408C/R
Manufacturer:
CMD
Quantity:
20 000
Part Number:
PACDN1408CG
Manufacturer:
ON/安森美
Quantity:
20 000
© 2000 California Micro Devices Corp. All rights reserved.
Features
• 4, 8, or 16 transient voltage suppressors in a
• In-system Electrostatic Discharge (ESD)
• Compact Chip Scale Package (0.65mm pitch) format
Product Description
The PACDN1404C, PACDN1408C and PACDN1416C
are transient voltage suppressor arrays that provide a
very high level of protection for sensitive electronic
components that may be subjected to ESD.
These devices are designed and characterized to safely
dissipate ESD strikes at levels well beyond the maxi-
mum requirements set forth in the IEC 61000-4-2
international standard (Level 4, 8kV contact discharge).
All I/Os are rated at 25kV using the IEC 61000-4-2
contact discharge method. Using the MIL-STD-883D
215 Topaz Street, Milpitas, California 95035
single package
protection to 25kV contact discharge per
IEC 61000-4-2 international standard
saves board space and eases layout in space
critical applications compared to discrete
solutions and traditional wire bonded packages
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ESD Protection Arrays, Chip Scale Package
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PACDN1408C
SCHEMATIC DIAGRAMS
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Tel: (408) 263-3214
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Applications
• ESD protection of I/O port connections,
• Protection of interface ports or IC pins which are
(Method 3015) specification for Human Body Model
(HBM) ESD, all pins are protected for contact discharges
to greater than 30kV.
The Chip Scale Package format of these devices enable
extremely small footprints that are necessary in portable
electronics such as cellular phones, PDAs, internet
appliances and PCs. The large solder bumps allow for
standard attachment to laminate boards without the use
of underfill.
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such as cellular phone, PDA, internet appliance
and PC ports
exposed to high levels of ESD
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Fax: (408) 263-7846
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www.calmicro.com
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PACDN1404C
PACDN1408C
PACDN1416C
C1230700
1
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