MCIMX31 Motorola Semiconductor Products, MCIMX31 Datasheet

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MCIMX31

Manufacturer Part Number
MCIMX31
Description
Manufacturer
Motorola Semiconductor Products
Datasheet

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Freescale Semiconductor
Data Sheet: Advance Information
i.MX31 and i.MX31L
Multimedia Applications
Processors
1
The i.MX31 (MCIMX31) and i.MX31L (MCIMX31L)
multimedia applications processors represent the next
step in low-power, high-performance application
processors. Unless otherwise specified, the material in
this data sheet is applicable to both the i.MX31 and
i.MX31L processors and referred to singularly
throughout this document as i.MX31. The i.MX31L does
not include a graphics processing unit (GPU).
Based on an ARM11™ microprocessor core, the
i.MX31 provides the performance with low power
consumption required by modern digital devices such
as:
The i.MX31 takes advantage of the ARM1136JF-S™
core running at up to 532 MHz, and is optimized for
This document contains information on a new product. Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2005, 2006, 2007. All rights reserved.
Preliminary—Subject to Change Without Notice
product. Specifications and information herein
This document contains information on a new
are subject to change without notice.
Introduction
Feature-rich cellular phones
Portable media players and mobile gaming
machines
Personal digital assistants (PDAs) and Wireless PDAs
Portable DVD players
Digital cameras
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Functional Description and Application
3 Signal Descriptions . . . . . . . . . . . . . . . . . . . . . 9
4 Electrical Characteristics . . . . . . . . . . . . . . . 10
5 Package Information and Pinout . . . . . . . . 103
6 Product Differences . . . . . . . . . . . . . . . . . . 120
7 Product Documentation . . . . . . . . . . . . . . . 121
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Ordering Information . . . . . . . . . . . . . . . . . 3
1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . 4
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 ARM11 Microprocessor Core . . . . . . . . . . . 4
2.2 Module Inventory . . . . . . . . . . . . . . . . . . . . 6
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . 10
4.2 Supply Power-Up/Power-Down
4.3 Module-Level Electrical Specifications . . . 20
5.1 MAPBGA Production Package—457
5.2 MAPBGA Production Package—473
7.1 Revision History . . . . . . . . . . . . . . . . . . . 121
See
MCIMX31 and
Requirements and Restrictions . . . . . . . . 18
14 x 14 mm, 0.5 mm Pitch . . . . . . . . . . . 103
19 x 19 mm, 0.8 mm Pitch . . . . . . . . . . . 111
Table 1 on page 3
Case 1581 14 x 14 mm, 0.5 mm Pitch
Case 1931 19 x 19 mm, 0.8 mm Pitch
MCIMX31L
Document Number: MCIMX31
Package Information
Ordering Information
Plastic Package
for ordering information.
Rev. 3.2, 08/2007

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