FAN1539 Fairchild Semiconductor, FAN1539 Datasheet - Page 3

• Manufacturer Part Number: FAN1539
• Description: 1A/1.3A/ LDO With Low Quiescent Current
• Manufacturer: Fairchild Semiconductor

PRODUCT SPECIFICATION
Absolute Maximum Ratings
Notes:
3. Junction to ambient thermal resistance,
4. Soldering temperature should be 260
5. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
REV. 1.0.8 3/22/04
Operating Input Voltage
Power Dissipation
Short Circuit Output Current
Operating Junction Temperature Range
Thermal Resistance- Junction to Tab, TO-252
Thermal Resistance- Junction to Tab, 3mmx3mm 6-lead MLP (Note 3)
Thermal Resistance- Junction to Tab, 5mmx6mm 8-lead MLP (Note 3)
Storage Temperature Range (Note 3)
Lead Temperature (I.R. Reflow) 30Sec.
(Note 4)
Lead Temperature (Soldering) 10Sec.
(Note 4)
Electrostatic Discharge Protection (Note 5)
copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink
characteristics.Thermal resistance(
rate of temperature rise is 3
°
C/SEC to within 100
Parameter
°
JA
C for 10 second after 240
), V
JA,
IN
is a strong function of PCB material, board thickness, thickness and number of
, I
OUT
°
C of the final temperature.
must be chosen not to exceed T
°
C for 30 second in I.R. reflow using 60/40 solder. Maximum
HBM
CDM
Symbol
T
T
T
I
ESD
V
OSH
LEAD
LEAD
P
T
STG
J
JC
JC
JC
IN
D
J
= 150
°
C.
-65 to 150
Internally
Internally
0 to 150
Limited
Limited
Value
240
260
10
3
8
4
4
2
FAN1539/FAN1540
Units
°C/W
°C/W
°C/W
kV
°C
°C
°C
°C
W
V
A
3