TDC-GP2 acam messelectronic gmbh, TDC-GP2 Datasheet - Page 11

• Manufacturer Part Number: TDC-GP2
• Description: Precision Time Interval Measurement
• Manufacturer: acam messelectronic gmbh

2.4 Package Drawings
Symbol
D
E
A
A1
b
e
L
Thermal resistance:
Roughly 40 K/W at 0 m/s air flow, 37 K/W at 1 m/s air flow, 35 K/W at 2m/s air flow (values just for reference).
2.4.1 Temperature profile
The temperature profile for infrared reflow furnace (in which the temperature is the resin’s surface temperature)
should be maintained within the range described below.
Maximum temperature
The maximum temperature requirement for
the resin surface, given 260ºC as the peak
temperature of the package body’s surface,
is that the resin surface temperature must
not exceed 250ºC for more than 10
seconds. This temperature should be kept as
low as possible to reduce the load caused by
thermal stress on the package, which is why
soldering for short periods only is
recommended. In addition to using a suitable
temperature profile, we also recommend
that you check carefully to confirm good
soldering results.
25
26
27
28
29
30
31
32
Min
0.1
0.3
0
7
-
-
-
-
Dimension in
En_Stop2
En_Stop1
Stop2
GND
Vcc
Stop1
Start
En_Start
Millimeters
acam-messelectronic gmbh - Am Hasenbiel 27 - D-76297 Stutensee-Blankenloch - Germany - www.acam.de
0.5
No
m
5
5
-
-
-
-
Max
0.3
0.5
1
-
-
-
-
Enable pin stop input 2
Enable pin stop input 1
Stop input 2
Ground
Core supply voltage
Stop input 1
Start input
Enable pin start input
D
A1
E
A
L
11
e
Schmitt trigger
Schmitt trigger
Schmitt trigger
b
HIGH active Vio
HIGH active Vio
HIGH active Vio
2.4 Package Drawings
TDC-GP2
GND
GND