BZM55C PanJit Semiconductors (Pan Jit), BZM55C Datasheet
BZM55C
Manufacturer Part Number
BZM55C
Description
Surface Mount Zener Diodes
Manufacturer
PanJit Semiconductors (Pan Jit)
Datasheet
1.BZM55C.pdf
(3 pages)
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STAD-JAN.27.2004
P
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• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Case: Molded Glass MICRO-MELF
• Terminals: Solderable per MIL-STD-202E, Method 208
• Polarity: See Diagram Below
• Approx. Weight: 0.01 grams
• Mounting Position: Any
• Packing information
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MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
BZM55-C2V4 SERIES
SURFACE MOUNT ZENER DIODES
FEATURES
MECHANICAL DATA
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PAGE . 1
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BZM55C Summary of contents
Page 1
BZM55-C2V4 SERIES SURFACE MOUNT ZENER DIODES 2 Volts VOLTAGE FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes MECHANICAL DATA • Case: Molded Glass MICRO-MELF • Terminals: Solderable per MIL-STD-202E, Method ...
Page 2
...
Page 3
RATING AND CHARACTERISTIC CURVES STAD-JAN.27.2004 500 400 300 200 100 0 50 100 150 200 AMBIENT TEMPERATURE, C FIG. 1 POWER DERATING CURVE Fig.2 BREAKDOWN CHARACTERISTICS 250 O Vz (V) 20 ...