NE681M23 Renesas Electronics Corporation., NE681M23 Datasheet

NE681M23

Manufacturer Part Number

NE681M23

Description

Npn Silicon Transistor

Manufacturer

Renesas Electronics Corporation.

Datasheet

1.NE681M23.pdf (2 pages)

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ELECTRICAL CHARACTERISTICS

FEATURES

The NE681M23 transistor is ideal for low noise, high gain,

and low cost amplifier applications. NEC's new low profile/

ceramic substrate style "M23" package is ideal for today's

portable wireless applications. The NE681 is also available

in chip, Micro-x, and six different low cost plastic surface

mount package styles.

Notes:

1. Electronic Industrial Association of Japan.

2. Pulsed measurement, pulse width

3. Capacitance is measured with emitter and case connected to the guard terminal at the bridge.

• NEW MINIATURE M23 PACKAGE:

• HIGH GAIN BANDWIDTH PRODUCT:

• LOW NOISE FIGURE:

DESCRIPTION

SYMBOLS

– World's smallest transistor package footprint —

– Low profile/0.55 mm package height

– Ceramic substrate for better RF performance

NF = 1.4 dB

leads are completely underneath package body

= 7 GHz

CBO

EBO

21E

FE 2

RE 3

Gain Bandwidth at V

Noise Figure at V

Insertion Power Gain at V

Forward Current Gain at V

Collector Cutoff Current at V

Emitter Cutoff Current at V

Feedback Capacitance at V

350 s, duty cycle

PARAMETERS AND CONDITIONS

= 3 V, I

EIAJ

NPN SILICON TRANSISTOR

= 3 V, I

PRELIMINARY DATA SHEET

PACKAGE OUTLINE

REGISTERED NUMBER

PART NUMBER

= 3 V, I

= 7 mA, f = 1 GHz

= 3 V, I

= 1 V, I

= 3 V, I

= 10 V, I

= 7 mA, f = 1 GHz

= 25 C)

= 7 mA

= 0

2 %.

= 0, f = 1 MHz

= 0

OUTLINE DIMENSIONS

California Eastern Laboratories

UNITS

GHz

PACKAGE OUTLINE M23

0.6

MIN

4.5

0.15

NE681M23

PIN CONNECTIONS

1. Collector

2. Emitter

3. Base

(Units in mm)

BOTTOM VIEW

NE681M23

2SC5650

0.2

0.5

M23

TYP

1.4

0.15

0.25

0.4

MAX

145

2.7

0.9

0.8

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NE681M23 Summary of contents

Page 1

... T • LOW NOISE FIGURE 1.4 dB DESCRIPTION The NE681M23 transistor is ideal for low noise, high gain, and low cost amplifier applications. NEC's new low profile/ ceramic substrate style "M23" package is ideal for today's portable wireless applications. The NE681 is also available in chip, Micro-x, and six different low cost plastic surface mount package styles ...

Page 2

ABSOLUTE MAXIMUM RATINGS SYMBOLS PARAMETERS V Collector to Base Voltage CBO V Collector to Emitter Voltage CEO V Emitter to Base Voltage EBO I Collector Current C P Total Power Dissipation T T Junction Temperature J T Storage Temperature STG ...

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