CMZB12 TOSHIBA Semiconductor CORPORATION, CMZB12 Datasheet
CMZB12
Related parts for CMZB12
CMZB12 Summary of contents
Page 1
... Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). TM (Ta = 25°C) Symbol Rating Unit P 1.0 (Note 1) W −40 to 150 T °C j −40 to 150 T °C stg 1 CMZB12~CMZB53 Unit: mm ② ① 0.16 1.75 ± 0.1 + 0.2 − 0.1 2.4 ① ANODE ② CATHODE JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) 2008-10-30 ...
Page 2
... CMZB12~CMZB53 Forward Voltage Reverse Current V (V) I (μ Measure- Measure- ment Max Max Current Max I ( 1.2 0 1.2 0 1.2 0 1.2 0 1.2 0 ...
Page 3
... When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. 3) Please refer to the Rectifiers databook for further information. Part No. Abbreviation Code B30 CMZB30 B33 CMZB33 B36 CMZB36 B39 CMZB39 B43 CMZB43 B47 CMZB47 B51 CMZB51 B53 CMZB53 Unit: mm 1.4 -tw. 3 CMZB12~CMZB53 of below 120°C. j 2008-10-30 ...
Page 4
... Soldering land: 6.0 mm × 6.0 mm board thickness: 1.6 mm 120 0.2 0.4 0.6 0.8 Power dissipation P (W) α – CMZB12 to CMZB27 Zener voltage V ( – (j-a) 1000 Device mounted on a glass-epoxy board: Board size × Soldering land: 2.1 mm × 1.4 mm Board thickness: 1 ...
Page 5
... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. CMZB12~CMZB53 5 20070701-EN GENERAL 2008-10-30 ...