HFBR-5301 Avago Technologies, HFBR-5301 Datasheet - Page 2

• Manufacturer Part Number: HFBR-5301
• Description: Fibre Channel 133 Mbd And 266 Mbd Transceivers In Low Cost 1x9 Package Style
• Manufacturer: Avago Technologies

DATA OUT
SIGNAL
DETECT
OUT
DATA IN
Figure 1. Block Diagram.
Transmitter Sections
The transmitter sections of the HFBR-5301 and HFBR-5302
utilize 1300 nm InGaAsP LEDs. These LEDs are packaged in
the optical subassembly portion of the transmitter section.
They are driven by a custom silicon IC which converts PECL
logic signals, into an analog LED drive current.
Receiver Sections
The receiver sections of the HFBR-5301 and HFBR-5302 uti-
lize InGaAs PIN photo diodes coupled to a custom silicon
transimpedance preamplifier IC.
These are packaged in the optical subassembly portion of
the receiver.
These PIN/preamplifier combinations are coupled to a
custom quantizer IC which provides the final pulse shap-
ing for the logic output and the Signal Detect function.
The Data output is differential. The Signal Detect output
is single-ended. Both data and signal detect outputs are
PECL compatible, ECL referenced (shifted) to a +5 volt
power supply.
Package
The overall package concept for the Avago Fibre Chan-
nel transceivers consists of three basic elements; the two
optical subassemblies, an electrical subassembly and the
housing with integral duplex SC connector interface. This
is illustrated in the block diagram in Figure 1.
The package outline drawing and pin out are shown in
Figures 2 and 3. The details of this package outline and
pin out are compliant with the multisource definition of
the 1x9 single in-line package (SIP). The low profile of the
Avago transceiver design complies with the maximum
height allowed for the duplex SC connector over the entire
length of the package.
The optical subassemblies utilize a high volume assembly
process together with low cost lens elements which result
in a cost effective building block. The electrical subas-
2
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
DRIVER IC
TOP VIEW
PREAMP IC
DUPLEX SC
RECEPTACLE
PIN
OPTICAL
SUBASSEMBLIES
LED
sembly consists of a high volume multilayer printed circuit
board to which the IC chips and various surfacemount
passive circuit elements are attached.
The package includes internal shields for the electrical
and optical subassemblies to insure high immunity to
external EMI fields and low EMI emissions. The outer hous-
ing, including the duplex SC connector, is molded of filled
non-conductive plastic to provide mechanical strength
and electrical isolation. The solder posts are isolated from
the circuit design of the transceiver, while they can be
connected to a ground plane on the circuit board, doing
so will have no impact on circuit performance. The trans-
ceiver is attached to a printed circuit board with the nine
signal pins and the two solder posts which exit the bottom
of the housing. The two solder posts provide the primary
mechanical strength to withstand the loads imposed on
the transceiver by mating with the duplex SC connectored
fiber cables.
Application Information
The Applications Engineering group in the Avago Opti-
cal Communication Division is available to assist with the
technical understanding and design trade-offs associated
with these transceivers. You can contact them through
your local Avago sales representative. The following
information is provided to answer some of the most
common questions about the use of these parts.Figure
6. Recommended Decoupling and Termination Circuits.
Figure 7. Recommended Board Layout Hole Pattern.Figure
6. Recommended Decoupling and Termination Circuits.
Figure 7. Recommended Board Layout Hole Pattern.Figure
6. Recommended Decoupling and Termination Circuits.
Figure 7. Recommended Board Layout Hole Pattern.