ARF1511 Microsemi Corporation, ARF1511 Datasheet - Page 2

• Manufacturer Part Number: ARF1511
• Description: Rf Power Mosfet
• Manufacturer: Microsemi Corporation

DYNAMIC CHARACTERISTICS
FUNCTIONAL CHARACTERISTICS
1 Pulse Test: Pulse width < 380 μS, Duty Cycle < 2%.
2 Repetitive Rating: Pulse width limited by maximum junction
3 Starting T
Microsemi reserves the right to change, without notice, the specifi cations and information contained herein.
27.05 mm
Symbol
Symbol
temperature.
1.065"
t
t
C
C
E
G
C
E
d(on)
d(off)
Ψ
oss
t
t
η
rss
AR
AS
iss
PS
r
f
.254
S1D2
.300
D1
G1
G2
S2
j
= +25°C, L = 2.25mH, R
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Repetitive Avalanche Energy
Single Pule Avalanche Energy
Characteristic
Common Source Amplifi er Power Gain
Drain Effi ciency
Electrical Ruggedness VSWR 6:1
ARF 1511
Heat Sink
ARF1511
1.065"
27.05 mm
G
= 25Ω, Peak I
.045
Clamp
S3D4
.300
D3
G3
G4
S4
.005
2
3
.100
.175
.100
.075
.100
.175
.100
.075
.100
L
= 20A
Thermal Considerations and Package Mounting:
surface is at 25°C and the junction temperature is 200°C. The thermal resistance be-
tween junctions and case mounting surface is 0.12°C/W. When installed, and additional
thermal impedance of 0.08°C/W between the package base and the mounting surface
is typical. Insure that the mounting surface is smooth and fl at. Thermal joint compound
must be used to reduce the effects of small surface irregularities. The heat sink should
incorporate a copper heat spreader to obtain best results.
the required mounting pressure while allowing for thermal expansion of both the device
and the heat sink. A simple clamp and two 6-32 (M3.5) screw can provide the minimum
125lb required mounting force. T = 12 in-lb.
V
The rated 1500W power dissipation is only available when the package mounting
The package is designed to be clamped to a heatsink. A clamped joint maintains
G1
G2
GS
Test Conditions
I
Test Conditions
= 0V
D
D1
S2
f = 40.7 MHz
V
P
V
= 20A @ 25°C
R
V
f = 1 MHz
V
DD
out
DS
GS
G
GS
S1D2
= 1.6 Ω
= 250V
= 750W
= 200V
= 15V
= 0V
S3D4
V
DD
D3
S4
= 380V
G3
G4
No Degradation in Output Power
MIN
450
MIN
10
13
HAZARDOUS MATERIAL
The ceramic portion of the device
between leads and mounting surface
is beryllium oxide, BeO. Beryllium
oxide dust is toxic when inhaled.
Care must be taken during handling
and mounting to avoid damage to
this area. These devices must never
be thrown away with general industri-
al or domestic waste.
1200
TYP
TYP
150
4.4
60
20
15
75
7
6
WARNING
1400
MAX
MAX
200
90
ARF1511
UNIT
UNIT
mJ
dB
pF
ns
%