HVL192 Renesas Electronics Corporation., HVL192 Datasheet
HVL192
Related parts for HVL192
HVL192 Summary of contents
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... Suitable for an antenna switches of wireless LAN and a cordless telephone. Super -Low capacitance.(C = 0.30 pF max) Low forward resistance. (rf = 3.2 Extremely small Flat Lead Package (EFP) is suitable for surface mount design. Ordering Information Type No. HVL192 Pin Arrangement Rev.1.00 Nov 24, 2005 page max) Laser Mark Package Name ...
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... HVL192 Absolute Maximum Ratings Item Reverse voltage Forward current Power dissipation Junction temperature Storage temperature Electrical Characteristics Item Symbol Reverse current I R Forward voltage V F Capacitance C Forward resistance r f Note For EFP package, the material of lead is exposed for cutting plane. There for, soldering nature of lead tip part is considered as unquestioned ...
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... HVL192 Main Characteristic - 75° - 0.2 0.4 Forward voltage V Fig.1 Forward current vs. Forward voltage 1.0 0.1 0.1 1.0 Reverse voltage V Fig.3 Capacitance vs. Reverse voltage Rev.1.00 Nov 24, 2005 page - 25°C 10 -11 10 -12 10 -13 10 -14 10 0.6 0.8 1.0 ( 1MHz ...
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... HVL192 Package Dimensions Package Name JEITA Package Code RENESAS Code EFP PXSF0002ZA Rev.1.00 Nov 24, 2005 page Previous Code MASS[Typ.] EFP / EFPV 0.0007g φ Pattern of terminal position areas Dimension in Millimeters Reference Symbol Min Nom Max A 0.44 0.47 0.50 b 0.25 0.30 0.35 c ...
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Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead ...