74HC365N,652 NXP Semiconductors, 74HC365N,652 Datasheet

IC BUFF DVR TRI-ST HEX 16PDIP

74HC365N,652

Manufacturer Part Number
74HC365N,652
Description
IC BUFF DVR TRI-ST HEX 16PDIP
Manufacturer
NXP Semiconductors
Series
74HCr
Datasheets
1.74HCT4046ADB112.pdf (19 pages)
2.74HCT4046ADB112.pdf (23 pages)
3.74HCT365N652.pdf (7 pages)

Specifications of 74HC365N,652

Package / Case
16-DIP (0.300", 7.62mm)
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
6
Current - Output High, Low
7.8mA, 7.8mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Logic Family
HC
Number Of Channels Per Chip
6
Polarity
Non-Inverting
Supply Voltage (max)
6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 7.8 mA
Input Bias Current (max)
8 uA
Low Level Output Current
7.8 mA
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
95 ns @ 2 V or 19 ns @ 4.5 V or 16 ns @ 6 V
Number Of Lines (input / Output)
6 / 6
Logical Function
Buffer/Line Driver
Number Of Elements
1
Number Of Channels
6
Number Of Inputs
6
Number Of Outputs
6
Operating Supply Voltage (typ)
5V
Package Type
PDIP
Operating Supply Voltage (max)
6V
Operating Supply Voltage (min)
2V
Quiescent Current
8uA
Technology
CMOS
Pin Count
16
Mounting
Through Hole
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1435-5
74HC365N
933669580652
INTEGRATED CIRCUITS
DATA SHEET
Package outline drawings
January 1996
File under Integrated Circuits, IC06

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74HC365N,652 Summary of contents

Page 1

DATA SHEET Package outline drawings File under Integrated Circuits, IC06 INTEGRATED CIRCUITS January 1996 ...

Page 2

Philips Semiconductors Package outline drawings INDEX PACKAGE VERSIONS DIP SOT27-1 plastic dual in-line package; 14 leads (300 mil) SOT38-4 plastic dual in-line package; 16 leads (300 mil) SOT146-1 plastic dual in-line package; 20 leads (300 mil) SOT101-1 plastic dual in-line ...

Page 3

Philips Semiconductors Package outline drawings DIP DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b ...

Page 4

Philips Semiconductors Package outline drawings DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. ...

Page 5

Philips Semiconductors Package outline drawings DIP20: plastic dual in-line package; 20 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. ...

Page 6

Philips Semiconductors Package outline drawings DIP24: plastic dual in-line package; 24 leads (600 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...

Page 7

Philips Semiconductors Package outline drawings DIP24: plastic dual in-line package; 24 leads (300 mil pin 1 index 1 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions UNIT b max. min. ...

Page 8

Philips Semiconductors Package outline drawings DIP28: plastic dual in-line package; 28 leads (600 mil) handbook, full pagewidth pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT ...

Page 9

Philips Semiconductors Package outline drawings SO SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 10

Philips Semiconductors Package outline drawings SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 11

Philips Semiconductors Package outline drawings SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 12

Philips Semiconductors Package outline drawings SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 13

Philips Semiconductors Package outline drawings SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 14

Philips Semiconductors Package outline drawings SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 15

Philips Semiconductors Package outline drawings SO28: plastic small outline package; 28 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 16

Philips Semiconductors Package outline drawings SSOP SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 17

Philips Semiconductors Package outline drawings SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 18

Philips Semiconductors Package outline drawings SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 19

Philips Semiconductors Package outline drawings SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 20

Philips Semiconductors Package outline drawings TSSOP TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 21

Philips Semiconductors Package outline drawings TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 22

Philips Semiconductors Package outline drawings TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 23

Philips Semiconductors Package outline drawings TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

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