74AUP1G07GM,132 NXP Semiconductors, 74AUP1G07GM,132 Datasheet - Page 2

• Manufacturer Part Number: 74AUP1G07GM,132
• Description: IC BUFFER LOW PWR N-INV 6XSON
• Manufacturer: NXP Semiconductors
• Series: 74AUPr

Specifications of 74AUP1G07GM,132

• Logic Type: Buffer/Line Driver, Non-Inverting with Open Drain
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Current - Output High, Low: 4mA, 4mA
• Voltage - Supply: 0.8 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 6-XSON (Micropak™), SOT-886
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 74AUP1G07GM-H; 74AUP1G07GM-H; 935279018132

NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74AUP1G07
Product data sheet
Type number
74AUP1G07GW
74AUP1G07GM
74AUP1G07GF
74AUP1G07GN
74AUP1G07GS
Type number
74AUP1G07GW
74AUP1G07GM
74AUP1G07GF
74AUP1G07GN
74AUP1G07GS
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
2
Logic symbol
Ordering information
Marking
A
Package
Temperature range Name
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
mna623
Y
4
All information provided in this document is subject to legal disclaimers.
Fig 2.
TSSOP5
XSON6
XSON6
XSON6
XSON6
Rev. 4 — 2 September 2010
A
IEC logic symbol
2
Description
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
plastic extremely thin small outline package; no leads;
6 terminals; body 1 × 1.45 × 0.5 mm
plastic extremely thin small outline package; no leads;
6 terminals; body 1 × 1 × 0.5 mm
extremely thin small outline package; no leads;
6 terminals; body 0.9 × 1.0 × 0.35 mm
extremely thin small outline package; no leads;
6 terminals; body 1.0 × 1.0 × 0.35 mm
Marking code
pS
pS
pS
pS
pS
mna624
4
Y
Low-power buffer with open-drain output
[1]
Fig 3.
A
Logic diagram
74AUP1G07
© NXP B.V. 2010. All rights reserved.
mna625
GND
Y
Version
SOT353-1
SOT886
SOT891
SOT1115
SOT1202
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