74LVT2244MTCX Fairchild Semiconductor, 74LVT2244MTCX Datasheet - Page 6

• Manufacturer Part Number: 74LVT2244MTCX
• Description: IC BUFF/DVR TRI-ST DUAL 20TSSOP
• Manufacturer: Fairchild Semiconductor
• Series: 74LVTr

Specifications of 74LVT2244MTCX

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 2
• Number Of Bits Per Element: 4
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

©1999 Fairchild Semiconductor Corporation
74LVT2244, 74LVTH2244 Rev. 1.5.0
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
10.65
10.00
INDICATOR
(R0.10)
PIN ONE
8°
0°
(R0.10)
7.60
7.40
B
Figure 1. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
2.65 MAX
1.27
0.40
(1.40)
20
1
SEATING PLANE
DETAIL A
0.75
0.25
SCALE: 2:1
0.35
0.51
0.25
13.00
12.60
11.43
X 45°
GAGE PLANE
0.25
M
C
B
A
1.27
0.30
0.10
11
10
NOTES: UNLESS OTHERWISE SPECIFIED
A
A) THIS PACKAGE CONFORMS TO JEDEC
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
D) CONFORMS TO ASME Y14.5M-1994
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L
F) DRAWING FILENAME: MKT-M20BREV3
6
C
0.10 C
MS-013, VARIATION AC, ISSUE E
FLASH OR BURRS.
LAND PATTERN RECOMMENDATION
2.25
1.27
SEE DETAIL A
SEATING PLANE
0.65
www.fairchildsemi.com
0.33
0.20
9.50