TLE 42764DV Infineon Technologies, TLE 42764DV Datasheet - Page 8

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TLE 42764DV

Manufacturer Part Number
TLE 42764DV
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of TLE 42764DV

Packages
PG-TO252-5
Regulator Type
single output
Output Voltage
adj.
Accuracy
2.0 %
Max. Output Current
400mA
Dropout Voltage
250mV
4.3
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
Table 3
Pos.
TLE42764GV, TLE42764GV50 (PG-TO263-5)
4.3.1
4.3.2
4.3.3
4.3.4
4.3.5
TLE42764DV, TLE42764DV50 (PG-TO252-5)
4.3.6
4.3.7
4.3.8
4.3.9
4.3.10
TLE42764EV50 (PG-SSOP-14 exposed pad)
4.3.11
4.3.12
4.3.13
4.3.14
4.3.15
1) Not subject to production test, specified by design.
2) Specified
3) Specified
Data Sheet
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm
to www.jedec.org.
Parameter
Junction to Case
Junction to Ambient
Junction to Case
Junction to Ambient
Junction to Case
Junction to Ambient
R
R
Thermal Resistance
Thermal Resistance
thJA
thJA
value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
value is according to Jedec JESD 51-3 at natural convection on FR4 1s0p board; The Product
1)
1)
1)
1)
1)
1)
Symbol
R
R
R
R
R
R
thJC
thJA
thJC
thJA
thJC
thJA
8
Min.
3
board with 1 copper layer (1 x 70µm Cu).
Limit Values
Typ.
3.6
22
74
42
34
3.6
27
115
52
40
7
41
130
60
50
Max.
General Product Characteristics
Unit
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
Rev. 1.2, 2011-02-15
Conditions
measured to heat
slug
2)
footprint only
300 mm² heatsink
area
600 mm² heatsink
area
measured to heat
slug
2)
footprint only
300 mm² heatsink
area
600 mm² heatsink
area
2)
footprint only
300 mm
area on PCB
600 mm
area on PCB
3)
3)
3)
3)
TLE42764
2
2
heatsink
heatsink
3)
3)
3)
3)
3)

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