IR3500VMPBF International Rectifier, IR3500VMPBF Datasheet

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IR3500VMPBF

Manufacturer Part Number
IR3500VMPBF
Description
The IR3500V Control IC combined with one or more xPhase3 Phase IC implement the control and MOSFET driver functions for a VR11.1 CPU VTT power supply.
Manufacturer
International Rectifier
Datasheet

Specifications of IR3500VMPBF

Package
32-Lead MLPQ
Circuit
X-Phase Control IC
Switch Freq (khz)
250kHz to 1.5MHz
Pbf
PbF Option Available
DESCRIPTION
FEATURES
PGOOD
ENABLE
VRHOT
VID4
VID3
VID2
12V
The IR3500V Control IC combined with one or more xPhase3
MOSFET driver functions for a VR11.1 CPU VTT power supply.
Page 1 of 34
1 to X phase operation with matching Phase IC
0.7% overall system set point accuracy
Programmable 250kHz to 9MHz Daisy-chain digital phase timing clock oscillator frequency provides a per
phase switching frequency of 250kHz to 1.5MHz without external components
Programmable Dynamic VID Slew Rate
Programmable Load Line Output Impedance
High speed error amplifier with wide bandwidth of 30MHz and fast slew rate of 12V/us
Programmable converter current limit during soft start, hiccup with delay during normal operation
Central over voltage detection with programmable threshold and communication to phase IC(s)
Over voltage signal output to system with overvoltage detection during powerup and normal operation
Detection and protection of open remote sense line and open control loop
IC bias linear regulator control with programmable output voltage and UVLO
Programmable VRHOT function monitors temperature of power stage through a NTC thermistor
Remote sense amplifier with true converter voltage sensing and less than 50uA bias current
Simplified PGOOD output provides indication of proper operation and avoids false triggering
Small thermally enhanced 32L 5mm x 5mm MLPQ package
RoHS Compliant
1
2
3
4
5
6
7
8
VID7
VID6
VID5
VID4
VID3
VID2
VID1
VID0
RVCCLDRV
RHOTSET2
RHOTSET1
IR3500V
RVCCLFB1
RFB1
ROSC / OVP
Figure 1 – Single Phase VR11.1 CPU VTT Application Circuit
RVCCLFB2
RFB
RFB2
SS/DEL
VSETPT
OCSET
LGND
VDAC
VDRP
CFB
IIN
24
23
22
21
20
19
18
17
RDRP
ROCSET
ROSC
CSS/DEL
RVDAC
CVCCL
4.7uF
RCP
CVDAC
CCP1
CCP
XPHASE3
1
2
3
4
ISHARE
DACIN
LGND
PHSIN
IR3505
TM
CVCCL
VR11.1 CPU VTT CONTROL IC
GATEH
BOOST
VCCL
SW
TM
12
11
10
9
CBST2
Phase IC implement the control and
RTHERMISTOR1
RTHERMISTOR2
RCS
L
CCS
July 28, 2008
Close to
Power Stage
CIN
DISTRIBUTION
IMPEDANCE
DATA SHEET
IR3500V
COUT
VOUT SENSE+
VOUT+
VOUT-
VOUT SENSE-

Related parts for IR3500VMPBF

IR3500VMPBF Summary of contents

Page 1

DESCRIPTION The IR3500V Control IC combined with one or more xPhase3 MOSFET driver functions for a VR11.1 CPU VTT power supply. FEATURES • phase operation with matching Phase IC • 0.7% overall system set point accuracy • ...

Page 2

ORDERING INFORMATION Device IR3500V MTRPBF * IR3500V MPBF *Samples only ABSOLUTE MAXIMUM RATINGS Stresses beyond those listed below may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any ...

Page 3

RECOMMENDED OPERATING CONDITIONS FOR RELIABLE OPERATION WITH MARGIN 4.75V ≤ V ≤ 7.5V, -0.3V ≤ VOSEN- ≤ 0.3V, 0 CCL ELECTRICAL SPECIFICATIONS The electrical characteristics involve the spread of values guaranteed within the recommended operating conditions. Typical values represent the ...

Page 4

PARAMETER Soft Start and Delay Start Delay (TD1) Soft Start Time (TD2) VID Sample Delay (TD3) PGOOD Delay (TD4 + TD5) OC Delay Time V(IIN) – V(OCSET) = 500 mV SS/DEL to FB Input Offset With FB = 0V, adjust ...

Page 5

PARAMETER Over Voltage Protection (OVP) Comparators Threshold at Power-up Threshold during Normal Compare to V(VDAC) Operation OVP Release Voltage during Compare to V(VDAC) Normal Operation Threshold during Dynamic VID down Dynamic VID Detect Comparator Threshold Propagation Delay to IIN Measure ...

Page 6

PARAMETER VCCL Regulator Amplifier Reference Feedback Voltage VCCLFB Bias Current VCCLDRV Sink Current UVLO Start Threshold UVLO Stop Threshold Hysteresis General VCCL Supply Current Note 1: Guaranteed by design, but not tested in production Note 2: VDAC Output is trimmed ...

Page 7

PIN DESCRIPTION PIN# PIN SYMBOL 1-8 VID7-0 VID0 are grounded. VID6 is pulled up. VID2~4 are inputs to VID converter. 9 ENABLE Enable input. A logic low applied to this pin puts the IC ...

Page 8

VCCLDRV Output of the VCCL regulator error amplifier to control external transistor. The pin senses 12V power supply through a resistor. 31 PGOOD Open collector output that drives low during startup and under any external fault condition. Indicates converter ...

Page 9

Frequency and Phase Timing Control The oscillator and system clock frequency is programmable from 250kHz to 9MHZ by an external resistor (ROSC). The control IC system clock signal (CLKOUT) is connected to CLKIN of all the phase ICs. The phase ...

Page 10

This arrangement guarantees the error amplifier is always in control and can demand 0 to 100% duty cycle as required. It also favors response to a load step decrease which is appropriate given the low output to input voltage ratio ...

Page 11

TM Body Braking In a conventional synchronous buck converter, the minimum time required to reduce the current in the inductor in response to a load step decrease is; The slew rate of the inductor current can be significantly increased by ...

Page 12

The advantage of sensing the inductor current versus high side or low side sensing is that actual output current being delivered to the load is obtained rather than peak or sampled information about the switch currents. The output voltage can ...

Page 13

ENABLE VBIAS VCCL COMPARATOR ENABLE 250nS - BLANKING + INTEL DELAY 850mV 1.2V AMD COMPARATOR 800mV 1.14V + VCCLDRV - 80mV VCCL REGULATOR 120mV AMPLIFIER DISCHARGE VCCLFB + 4.0V COMPARATOR - 0.94 1.19V VCCL OUTPUT 0.86 0.2V COMPARATOR + VCCL ...

Page 14

Adaptive Voltage Positioning Adaptive voltage positioning is implemented needed to reduce the output voltage deviations during load transients and the power dissipation of the load at heavy load. The circuitry related to voltage positioning is shown in Figure 9. The ...

Page 15

The voltage at the VDRP pin is a buffered version of the share bus IIN and represents the sum of the DAC voltage and the average inductor current of all the phases. The VDRP pin is connected to the FB ...

Page 16

Figure 12 depicts the start-up sequence VR11 VID with boot voltage. If there is no fault, the SS/DEL pin will start charging when the enable crosses the threshold. The error amplifier output EAOUT is clamped low until SS/DEL reaches 1.4V. ...

Page 17

The delay is required since over-current conditions can occur as part of normal operation due to inrush current over-current occurs during soft start (before PGOOD is asserted), the SS/DEL voltage is regulated by the over current amplifier to ...

Page 18

Linear Regulator Output (VCCL) The IR3500V has a built-in linear regulator controller, and only an external NPN transistor is needed to create a linear regulator. The output voltage of the linear regulator can be programmed between 4.75V and 7.5V by ...

Page 19

Open Voltage Loop Detection The output voltage range of error amplifier is detected all the time to ensure the voltage loop is in regulation. If any fault condition forces the error amplifier output above VCCL-1.08V for 8 switching cycles, the ...

Page 20

Pre-charging of converter output voltage may trigger OVP. If the converter output is pre-charged above 1.73V as shown in Figure 17, the ROSC/OVP pin voltage will be higher than 1.6V when VCCLDRV voltage reaches 1.8V. ROSC/OVP pin voltage will be ...

Page 21

VCC VCCL+0.7V VCCL+0.7V VCCLDRV 1.8V OUTPUT VOLTAGE (VOSEN+) VCCL UVLO ROSC/OVP 1.6V Figure 16 - Over-voltage protection during power-up 12V VCC VCCL+0.7V VCCL+0.7V VCCLDRV 1.8V OUTPUT VOLTAGE (VOSEN+) 1.73V VCCL UVLO ROSC/OVP 1.6V Figure 17 - Over-voltage protection with ...

Page 22

VCC VCCL+0.7V VCCL+0.7V VCCLDRV OUTPUT 1.73V VOLTAGE (VOSEN+) VID + 0.13V VCCL UVLO VCCL - 1V ROSC/OVP 0.6V 3.92V (4V-0.08V) SS/DEL Figure 18 - Over-voltage protection with pre-charging converter output VID + 0.13V <Vo < 1.73V VID (FAST VDAC) ...

Page 23

Open Remote Sense Line Protection If either remote sense line VOSEN+ or VOSEN- or both are open, the output of remote sense amplifier (VO) drops. The IR3500V monitors VO pin voltage continuously voltage is lower than 200 mV, ...

Page 24

Open Open Control Daisy Loop Fault Clearing Recycle VCCL Method Error Amp Disabled ROSC/OVP & IIN drive high until No OV clears SS/DEL Discharge Flags PGood 8 Delay? 32 Clock PHSOUT Pulses Pulses APPLICATIONS INFORMATION DESIGN PROCEDURE Oscillator Resistor Rosc ...

Page 25

The minimum over-current fault latch delay time quantified OCDEL VDAC Slew Rate Programming Capacitor C ...

Page 26

OCSET  V ⋅ D  I  Where; I =Over current limit, n=Number of phases, K LIMIT G =Gain of the current sense amplifier D=Vo/V , m=Maximum integer ...

Page 27

V (max the above equation min) and V I above condition is not satisfied there is a need to use a device with higher β be used instead of a single NPN transistor. Thermistor R and ...

Page 28

For applications where AVP is not required, the compensation is the same as for the regular voltage mode control. For converters using Polymer, AL-Polymer, and ceramic capacitors, which have much higher ESR zero frequency, type III compensation is required as ...

Page 29

optional and may be needed in some applications to reduce the jitter caused by the high frequency noise. CP1 A ceramic capacitor between 10pF and 220pF is usually ...

Page 30

PCB LAYOUT GUIDELINES The following layout guidelines are recommended to reduce the parasitic inductance and resistance of the PCB layout, therefore minimizing the noise coupled to the IC. • Dedicate at least one middle layer for a ground plane LGND. ...

Page 31

PCB METAL AND COMPONENT PLACEMENT • Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should be ≥ 0.2mm to minimize shorting. • Lead land length should be equal to maximum part ...

Page 32

SOLDER RESIST • The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non ...

Page 33

STENCIL DESIGN • The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands. Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch devices the ...

Page 34

PACKAGE INFORMATION 32L MLPQ ( Body) – θ IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 www.irf.com Page 24.4 C/W, θ =0. Data and ...

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