STPS15L25 STMicroelectronics, STPS15L25 Datasheet
STPS15L25
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STPS15L25 Summary of contents
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... V 150 °C 0.35 V STPS15L25D PAK, this device is Parameter Tc = 145° 10ms Sinusoidal tp = 2µs square F=1kHz tp = 100µs square tp = 1µ 25°C STPS15L25D TO-220AC D PAK STPS15L25G Value 0.5 15 250 1 4 9000 - 150 150 10000 A NC Unit ...
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... STPS15L25D/G THERMAL RESISTANCES Symbol R Junction to case th(j-c) STATIC ELECTRICAL CHARACTERISTICS Symbol Parameters I * Reverse leakage current R * Forward voltage drop V F Pulse test : * tp = 380 µs, < evaluate the maximum conduction losses use the following equation : 0. 0.0073 I F(AV) F (RMS) Fig. 1: Average forward power dissipation versus average forward current ...
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... Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(nF) 5.0 1.0 0 Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 µm). (STPS15L25G only) Rth(j-a) (°C/ 1.0 1.2 1.4 STPS15L25D/G t(s) Single pulse 1 ...
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... STPS15L25D/G PACKAGE MECHANICAL DATA 2 D PAK 2.0 MIN. FLAT ZONE FOOT PRINT DIMENSIONS (in millimeters) 16.90 10.30 3.70 8.90 4/5 REF COOLING n (METHOD C) 5.08 1.30 DIMENSIONS Millimeters Inches Min. Max. Min. 4.40 4.60 0.173 2.49 2.69 0.098 0.03 0.23 0.001 0.70 0.93 0.027 1 ...
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... STPS15L25D STPS15L25G STPS15L25G STPS15L25G-TR STPS15L25G EPOXY MEETS UL94,V0 n Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics ...