PESD1FLEX NXP Semiconductors, PESD1FLEX Datasheet - Page 9

• Manufacturer Part Number: PESD1FLEX
• Description: PESD1FLEX in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plasticpackage designed to protect two automotive FlexRay bus lines from the damage causedby ElectroStatic Discharge (ESD) and other transients
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Soldering
PESD1FLEX_2
Product data sheet
Fig 10. Reflow soldering footprint SOT23 (TO-236AB)
Fig 11. Wave soldering footprint SOT23 (TO-236AB)
4.60
3.00
4.00
0.85
0.85
1.20
1.30
Rev. 02 — 15 February 2008
2
2
3.40
2.80
4.50
2.90
2.50
1.00
3.30
3
3
1.20 (2x)
0.50 (3x)
1
0.60 (3x)
1
0.60
(3x)
Dimensions in mm
preferred transport direction during soldering
sot023
FlexRay bus ESD protection diode
2.70
solder lands
solder resist
occupied area
PESD1FLEX
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
© NXP B.V. 2008. All rights reserved.
sot023
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