IP4359CX4 NXP Semiconductors, IP4359CX4 Datasheet
IP4359CX4
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IP4359CX4 Summary of contents
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... IP4359CX4 is fabricated using monolithic silicon technology in a single Wafer-Level Chip-Scale Package (WLCSP). These features make the IP4359CX4 ideal for use in applications requiring component miniaturization such as mobile phone handsets and other portable electronic devices. ...
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... WLCSP4 All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 August 2010 IP4359CX4 Dual channel low capacitance ESD protection Graphic symbol 2 008aaa236 008aaa239 Version IP4359CX4 IP4359CX4 © NXP B.V. 2010. All rights reserved ...
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... test voltage forward voltage dynamic resistance IEC 61000-4-5 test positive discharge negative discharge All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 August 2010 IP4359CX4 Dual channel low capacitance ESD protection [1] [1] Min [ 3 MHz 3 ...
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... NXP Semiconductors 6. Application information 6.1 Insertion loss The IP4359CX4 is mainly designed as an ESD protection device for high speed interfaces such as USB 2.0, DVI and HDMI high speed data lines etc. The insertion loss measurement configuration of a typical 50 Ω NetWork Analyzer (NWA) system for ...
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... NXP Semiconductors 6.2 Crosstalk The crosstalk measurement configuration of a typical 50 Ω NWA system for evaluation of the IP4359CX4 is shown in The crosstalk measurement results of IP4359CX4 are depicted in Fig 3. Fig 4. IP4359CX4 Product data sheet Figure 3. IN_1 IN_2 50 TEST BOARD 50 V gen Crosstalk measurement configuration 0 ct ...
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... NXP Semiconductors 7. Package outline WLCSP4: wafer level chip-size package; 4 bumps ( bump A1 index area European projection Fig 5. Package outline IP4359CX4 (WLCSP4) Table 5. Dimensions of IP4359CX4/LF for Symbol IP4359CX4 Product data sheet Figure 5 Min Typ ...
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... Solder mask aperture diameter Copper thickness Copper finish PCB material 8.2 PCB assembly guidelines for Pb-free soldering Table 8. Parameter Solder screen aperture diameter Solder screen thickness Solder paste: Pb-free Solder / flux ratio Solder reflow profile IP4359CX4 Product data sheet Dimensions of IP4359CX4/LF-H500 for Min Typ 0.41 0.45 0.18 0.20 0.23 0.25 0.21 0.26 0.71 0.76 0.71 ...
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... Pb-free solder reflow profile Characteristics Parameter peak reflow temperature time 1 time 2 time 3 time 4 time 5 rate of change of temperature All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 August 2010 IP4359CX4 Dual channel low capacitance ESD protection cooling rate t ( ...
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... Universal Serial Bus WLCSP Wafer-Level Chip-Scale Package 10. Revision history Table 11. Revision history Document ID Release date IP4359CX4 v.1 20100806 IP4359CX4 Product data sheet Dual channel low capacitance ESD protection Data sheet status Product data sheet All information provided in this document is subject to legal disclaimers. ...
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... Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 August 2010 IP4359CX4 © NXP B.V. 2010. All rights reserved ...
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... NXP Semiconductors’ product specifications. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 August 2010 IP4359CX4 © NXP B.V. 2010. All rights reserved ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com IP4359CX4 All rights reserved. Date of release: 6 August 2010 Document identifier: IP4359CX4 ...