BAS16_SER NXP Semiconductors, BAS16_SER Datasheet - Page 11
BAS16_SER
Manufacturer Part Number
BAS16_SER
Description
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)plastic packages
Manufacturer
NXP Semiconductors
Datasheet
1.BAS16_SER.pdf
(20 pages)
NXP Semiconductors
11. Soldering
BAS16_SER_5
Product data sheet
Fig 17. Reflow soldering footprint BAS16 (SOT23/TO-236AB)
Fig 18. Wave soldering footprint BAS16 (SOT23/TO-236AB)
4.6
3
1.7
2.6
(3 )
0.7
(2 )
1.4
1.4
Rev. 05 — 25 August 2008
(2 )
1.2
(3 )
(3 )
3.3
2.9
1.9
0.5
0.6
1
2.2
2.8
4.5
(3 )
0.6
2
preferred transport direction during soldering
High-speed switching diodes
BAS16 series
Dimensions in mm
Dimensions in mm
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
solder paste
occupied area
solder lands
solder resist
occupied area
sot023_fr
sot023_fw
11 of 20
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