PMEG4002EJ NXP Semiconductors, PMEG4002EJ Datasheet - Page 10

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection, encapsulated in a SOD323F (SC-90) small andflat lead Surface-Mounted Device (SMD) plastic package

PMEG4002EJ

Manufacturer Part Number
PMEG4002EJ
Description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection, encapsulated in a SOD323F (SC-90) small andflat lead Surface-Mounted Device (SMD) plastic package
Manufacturer
NXP Semiconductors
Datasheet

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Part Number
Manufacturer
Quantity
Price
Part Number:
PMEG4002EJ
Manufacturer:
NXP
Quantity:
33 400
NXP Semiconductors
10. Packing information
11. Soldering
PMEG4002EJ_1
Product data sheet
Table 8.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package
PMEG4002EJ SOD323F
Fig 16. Reflow soldering footprint SOD323F (SC-90)
For further information and the availability of packing methods, see
1.65
Reflow soldering is the only recommended soldering method.
0.95
Packing methods
(2 )
(2 )
0.5
0.6
Rev. 01 — 15 May 2009
Description
4 mm pitch, 8 mm tape and reel
3.05
2.2
2.1
200 mA low V
0.5 (2 )
0.6 (2 )
F
MEGA Schottky barrier rectifier
Section
PMEG4002EJ
[1]
14.
Dimensions in mm
Packing quantity
3000
-115
© NXP B.V. 2009. All rights reserved.
solder lands
solder resist
solder paste
occupied area
sod323f_fr
10000
-135
10 of 13

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