PMEG2020EH_EJ NXP Semiconductors, PMEG2020EH_EJ Datasheet
PMEG2020EH_EJ
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PMEG2020EH_EJ Summary of contents
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PMEG2020EH; PMEG2020EJ very low V Rev. 04 — 15 January 2010 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in ...
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... The marking bar indicates the cathode. 3. Ordering information Table 4. Type number PMEG2020EH PMEG2020EJ 4. Marking Table 5. Type number PMEG2020EH PMEG2020EJ PMEG2020EH_EJ_4 Product data sheet PMEG2020EH; PMEG2020EJ very low V Pinning Description cathode anode Ordering information Package Name Description - plastic surface mounted package; 2 leads SC-90 plastic surface mounted package ...
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... Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm [4] Soldering point of cathode tab. PMEG2020EH_EJ_4 Product data sheet PMEG2020EH; PMEG2020EJ very low V Limiting values Conditions ≤ ...
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... NXP Semiconductors 7. Characteristics Table 8. ° amb Symbol [1] Pulse test: t PMEG2020EH_EJ_4 Product data sheet PMEG2020EH; PMEG2020EJ very low V Characteristics C unless otherwise specified. Parameter Conditions forward voltage reverse current ...
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... T amb Fig 1. Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG2020EH_EJ_4 Product data sheet PMEG2020EH; PMEG2020EJ very low V 006aaa011 (mA − ...
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... Package outline SOD123F 9. Packing information Table 9. The -xxx numbers are the last three digits of the 12NC ordering code. Type number PMEG2020EH PMEG2020EJ [1] For further information and the availability of packing methods, see PMEG2020EH_EJ_4 Product data sheet PMEG2020EH; PMEG2020EJ very low V 1.2 1.0 0.55 0.35 2.7 2 ...
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... Soldering 2.1 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 6. Reflow soldering footprint SOD123F Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 7. Reflow soldering footprint SOD323F (SC-90) PMEG2020EH_EJ_4 Product data sheet PMEG2020EH; PMEG2020EJ very low V 4.4 4 2.9 1.6 1.6 1.1 (2×) 3 ...
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... MEGA Schottky barrier rectifiers F Data sheet status Change notice Product data sheet - Product data sheet - Product data sheet - Preliminary data sheet - Product data sheet - Preliminary data sheet - Rev. 04 — 15 January 2010 Supersedes PMEG2020EH_EJ_3 PMEG2020EH_2 PMEG2020EJ_2 PMEG2020EH_1 - PMEG2020EJ_1 - © NXP B.V. 2010. All rights reserved ...
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... NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 13. Contact information For more information, please visit: For sales office addresses, please send an email to: PMEG2020EH_EJ_4 Product data sheet PMEG2020EH; PMEG2020EJ very low V [3] Definition This document contains data from the objective specification for product development ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 15 January 2010 Document identifier: PMEG2020EH_EJ_4 ...