BYV25F-600 NXP Semiconductors, BYV25F-600 Datasheet - Page 4

Enhanced ultrafast power diode in a SOD59 (2-lead TO-220AC) plastic package

BYV25F-600

Manufacturer Part Number
BYV25F-600
Description
Enhanced ultrafast power diode in a SOD59 (2-lead TO-220AC) plastic package
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
5. Thermal characteristics
Table 5.
BYV25F-600
Product data sheet
Symbol
R
R
Fig 4.
th(j-mb)
th(j-a)
Transient thermal impedance from junction to mounting base as a function of pulse width
Thermal characteristics
Parameter
thermal resistance from
junction to mounting base
thermal resistance from
junction to ambient
Z
(K/W)
th(j-mb)
10
10
10
10
−1
−2
−3
1
10
−6
All information provided in this document is subject to legal disclaimers.
10
Conditions
see
in free air
−5
Rev. 02 — 7 March 2011
Figure 4
10
−4
10
−3
10
P
−2
10
t
p
−1
T
001aag913
δ =
1
t
p
T
(s)
t
t
p
10
Enhanced ultrafast power diode
Min
-
-
BYV25F-600
Typ
-
60
© NXP B.V. 2011. All rights reserved.
Max
2.5
-
Unit
K/W
K/W
4 of 11

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