K4P160411C-BC60 Samsung, K4P160411C-BC60 Datasheet

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K4P160411C-BC60

Manufacturer Part Number
K4P160411C-BC60
Description
DRAM Chip: FPM: 2MByte: 5V Supply: Commercial: SOJ: 28-Pin
Manufacturer
Samsung
Datasheet

Specifications of K4P160411C-BC60

Case
SOJ

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Part Number:
K4P160411C-BC60
Manufacturer:
SAMSUNG
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K4P160411C-BC60
Manufacturer:
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K4P170411C, K4P160411C
This is a family of 4,194,304 x 4 bit Quad CAS with Fast Page Mode CMOS DRAMs. Fast Page Mode offers high speed random access
of memory cells within the same row. Refresh cycle (2K Ref. or 4K Ref.), access time (-50 or -60), power consumption(Normal or Low
power) and package type(SOJ or TSOP-II) are optional features of this family. All of this family have CAS-before-RAS refresh, RAS-only
refresh and Hidden refresh capabilities. Furthermore, Self-refresh operation is available in L-version. Four separate CAS pins provide for
seperate I/O operation allowing this device to operate in parity mode.
This 4Mx4 Fast Page Mode Quad CAS DRAM family is fabricated using Samsung s advanced CMOS process to realize high band-
width, low power consumption and high reliability.
FEATURES
• Part Identification
• Refresh Cycles
• Performance Range
• Active Power Dissipation
Speed
K4P170411C
K4P160411C
-50
-60
- K4P170411C-B(F) (5V, 4K Ref.)
- K4P160411C-B(F) (5V, 2K Ref.)
Speed
-50
-60
Part
NO.
50ns
60ns
t
RAC
Refresh
13ns
15ns
t
cycle
CAC
4K
2K
495
440
4K
4M x 4Bit CMOS Quad CAS DRAM with Fast Page Mode
Refresh Cycle
110ns
90ns
t
RC
Normal
64ms
32ms
SAMSUNG ELECTRONICS CO., LTD. reserves the right to
change products and specifications without notice.
Refresh period
35ns
40ns
t
PC
605
550
2K
Unit : mW
128ms
L-ver
5V/3.3V
5V/3.3V
Remark
DESCRIPTION
(A0 - A10)
(A0 - A10)
CAS0 - 3
A0-A11
A0 - A9
RAS
Note)
W
*1
*1
*1
: 2K Refresh
FUNCTIONAL BLOCK DIAGRAM
• Fast Page Mode operation
• Four seperate CAS pins provide for separate I/O operation
• CAS-before-RAS refresh capability
• RAS-only and Hidden refresh capability
• Self-refresh capability (L-ver only)
• Fast paralleltest mode capability
• TTL compatible inputs and outputs
• Early Write or output enable controlled write
• JEDEC Standard pinout
• Available in Plastic SOJ and TSOP(II) packages
• Single +5V 10% power supply
Control
Clocks
Row Address Buffer
Col. Address Buffer
Refresh Counter
Refresh Control
Refresh Timer
VBB Generator
Column Decoder
Memory Array
4,194,304 x 4
Row Decoder
Cells
CMOS DRAM
Vcc
Vss
Data out
Data in
Buffer
Buffer
OE
DQ0
DQ3
to

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K4P160411C-BC60 Summary of contents

Page 1

... This 4Mx4 Fast Page Mode Quad CAS DRAM family is fabricated using Samsung s advanced CMOS process to realize high band- width, low power consumption and high reliability. FEATURES • Part Identification - K4P170411C-B(F) (5V, 4K Ref.) - K4P160411C-B(F) (5V, 2K Ref.) • Active Power Dissipation Refresh Cycle Speed 4K ...

Page 2

... K4P170411C, K4P160411C • K4P17(6)0411C DQ0 DQ1 W RAS *A11(N.C) CAS0 CAS1 A10 *A11 is N.C for K4P160411C(5V, 2K Ref. product 300mil 28 SOJ F : 300mil 28 TSOP II PIN CONFIGURATION (Top Views DQ3 3 26 DQ2 4 25 CAS3 *A11(N.C) ...

Page 3

... K4P170411C, K4P160411C ABSOLUTE MAXIMUM RATINGS Parameter Voltage on any pin relative Voltage on V supply relative Storage Temperature Power Dissipation Short Circuit Output Current * Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability ...

Page 4

... K4P170411C, K4P160411C DC AND OPERATING CHARACTERISTICS Symbol Power I Don t care CC1 Normal I Don t care CC2 L I Don t care CC3 I Don t care CC4 Normal I Don t care CC5 L I Don t care CC6 I L Don t care CC7 I L Don t care CCS Operating Current (RAS and CAS, Address cycling @t ...

Page 5

... K4P170411C, K4P160411C CAPACITANCE (T = Parameter Input capacitance [A0 ~ A11] Input capacitance [RAS, CASx, W, OE] Output capacitance [DQ0 - DQ3] AC CHARACTERISTICS ( Test condition : V =5.0V 10%, Vih/Vil=2.4/0.8V, Voh/Vol=2.4/0.4V CC Parameter Random read or write cycle time Read-modify-write cycle time Access time from RAS Access time from CAS ...

Page 6

... K4P170411C, K4P160411C AC CHARACTERISTICS (Continued) Parameter Data set-up time Data hold time Refresh period (2K, Normal) Refresh period (4K, Normal) Refresh period (L-ver) Write command set-up time CAS to W delay time RAS to W delay time Column address to W delay time CAS precharge to W delay time ...

Page 7

... K4P170411C, K4P160411C TEST MODE CYCLE Parameter Random read or write cycle time Read-modify-write cycle time Access time from RAS Access time from CAS Access time from column address RAS pulse width CAS pulse width RAS hold time CAS hold time Column address to RAS lead time ...

Page 8

... K4P170411C, K4P160411C NOTES An initial pause of 200us is required after power-up followed by any 8 RAS-only refresh or CAS-before-RAS refresh cycles 1. before proper device operation is achieved (min) and V (max) are reference levels for measuring timing of input signals Transition times are measured between V Measured with a load equivalent to 2 TTL loads and 100pF. ...

Page 9

... K4P170411C, K4P160411C READ CYCLE NOTE : D = OPEN OUT RAS CAS0 CAS1 CAS2 CAS3 DQ0 ~ DQ3 RAS t CSH t CRP t RCD t CRP t CRP t CRP t RAD ...

Page 10

... K4P170411C, K4P160411C WRITE CYCLE ( EARLY WRITE ) RAS CAS0 CAS1 CAS2 CAS3 DQ0 ~ DQ3 RAS t CSH t CRP t RCD t CRP t CRP t CRP t CSH t RAD ...

Page 11

... K4P170411C, K4P160411C WRITE CYCLE ( OE CONTROLLED WRITE ) RAS CAS0 CAS1 CAS2 CAS3 DQ0 ~ DQ3 RAS t CSH t CRP t RCD t CRP t CRP t CRP t RAD ...

Page 12

... K4P170411C, K4P160411C READ - MODIFY - WRTIE CYCLE RAS CAS0 CAS1 CAS2 CAS3 DQ0 ~ DQ3 RAS t CSH t CRP t RCD t CRP t CRP t CRP t RAD ...

Page 13

... K4P170411C, K4P160411C FAST PAGE READ CYCLE NOTE : D = OPEN OUT RAS CRP CAS0 CAS1 CAS2 CAS3 ASR DQ0 DQ1 DQ2 ...

Page 14

... K4P170411C, K4P160411C FAST PAGE WRITE CYCLE ( EARLY WRITE ) RAS CRP CAS0 CAS1 CAS2 CAS3 ASR ADDR DQ0 DQ1 DQ2 ...

Page 15

... K4P170411C, K4P160411C FAST PAGE READ - MODIFY - WRITE CYCLE RAS CAS0 CAS1 CAS2 CAS3 ASR ROW A ADDR RCS DQ0 ~ DQ3 RCD t CAS t CLCH ...

Page 16

... K4P170411C, K4P160411C RAS - ONLY REFRESH CYCLE NOTE : W, OE Don t care OPEN OUT RAS CRP CASX ASR CAS - BEFORE - RAS REFRESH CYCLE NOTE : OE Don t care RAS CASX DQ0 ~ DQ3 ...

Page 17

... K4P170411C, K4P160411C HIDDEN REFRESH CYCLE ( READ ) RAS CASX DQX RAS t CRP t t RCD RSH t RAD ASR RAH ASC t CAH ROW COLUMN ADDRESS ADDRESS t RCS CLZ ...

Page 18

... K4P170411C, K4P160411C HIDDEN REFRESH CYCLE ( WRITE ) NOTE : D = OPEN OUT RAS CASX DQX RAS t CRP t t RCD RSH t RAD ASR RAH ASC t CAH ROW COLUMN ADDRESS ADDRESS ...

Page 19

... K4P170411C, K4P160411C CAS - BEFORE - RAS SELF REFRESH CYCLE NOTE : OE Don t care RAS CASX DQ0 ~ DQ3 TEST MODE IN CYCLE NOTE : OE Don t care RAS CASX DQ0 ~ DQ3 ...

Page 20

... K4P170411C, K4P160411C PACKAGE DIMENSION 28 SOJ 300mil #28 #1 0.0375 (0.95) 28 TSOP(II) 300mil 0.037 (0.95) 0.741 (18.82) MAX 0.720 (18.30) 0.730 (18.54) 0.050 (1.27) 0.026 (0.66) 0.032 (0.81) 0.015 (0.38) 0.021 (0.53) 0.741 (18.81) MAX 0.721 (18.31) 0.047 (1.20) 0.729 (18.51) MAX 0.050 (1.27) 0.002 (0.05) MIN 0.012 (0.30) 0.020 (0.50) CMOS DRAM Units : Inches (millimeters) 0.006 (0.15) 0.012 (0.30) 0.027 (0.69) MIN Units : Inches (millimeters) ...

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