MT48LC1M16A1TG-7S Micron Semiconductor Products, MT48LC1M16A1TG-7S Datasheet

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MT48LC1M16A1TG-7S

Manufacturer Part Number
MT48LC1M16A1TG-7S
Description
512 K x 16 x 2banks, 143MHz synchronous DRAM
Manufacturer
Micron Semiconductor Products
Datasheet

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SYNCHRONOUS
DRAM
FEATURES
• PC100 functionality
• Fully synchronous; all signals registered on
• Internal pipelined operation; column address can
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8 or full page
• Auto Precharge Mode, includes CONCURRENT
• Self Refresh and Adaptable Auto Refresh Modes
• LVTTL-compatible inputs and outputs
• Single +3.3V ±0.3V power supply
• Supports CAS latency of 1, 2 and 3
OPTIONS
• Configuration
• Plastic Package - OCPL*
• Timing (Cycle Time)
• Refresh
KEY TIMING PARAMETERS
*Off-center parting line
**CL = CAS (READ) latency
16Mb: x16 SDRAM
16MSDRAMx16.p65 – Rev. 8/99
SPEED
positive edge of system clock
be changed every clock cycle
1 Meg x 16 - 512K x 16 x 2 banks architecture with
11 row, 8 column addresses per bank
AUTO PRECHARGE
- 32ms, 2,048-cycle refresh or
- 64ms, 2,048-cycle refresh or
- 64ms, 4,096-cycle refresh
1 Meg x 16 (512K x 16 x 2 banks)
50-pin TSOP (400 mil)
6ns (166 MHz)
7ns (143 MHz)
8ns (125 MHz)
2K or 4K with Self Refresh Mode at 64ms
-8A
-6
-7
166 MHz
143 MHz
125 MHz
CLOCK
MT48LC1M16A1TG-7S
Part Number Example:
ACCESS TIME
CL = 3**
5.5ns
5.5ns
6ns
SETUP
2ns
2ns
2ns
MARKING
1M16A1
-8A
T G
-6
-7
HOLD
S
1ns
1ns
1ns
1
MT48LC1M16A1 S - 512K x 16 x 2 banks
For the latest data sheet, please refer to the Micron Web
site:
GENERAL DESCRIPTION
random-access memory containing 16,777,216 bits. It
is internally configured as a dual 512K x 16 DRAM with
a synchronous interface (all signals are registered on
the positive edge of the clock signal, CLK). Each of the
512K x 16-bit banks is organized as 2,048 rows by 256
columns by 16 bits. Read and write accesses to the
SDRAM are burst oriented; accesses start at a selected
location and continue for a programmed number of
16MB (X16) SDRAM PART NUMBER
Note: The # symbol indicates signal is active LOW.
Configuration
Refresh Count
Row Addressing
Bank Addressing
Column Addressing
PART NUMBER
MT48LC1M16A1TG S
The 16Mb SDRAM is a high-speed CMOS, dynamic
www.micronsemi.com/datasheets/sdramds.html
PIN ASSIGNMENT (Top View)
DQML
V
V
CAS#
RAS#
Micron Technology, Inc., reserves the right to change products or specifications without notice.
VssQ
VssQ
WE#
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DD
DD
A10
V
V
CS#
BA
A0
A1
A2
A3
DD
DD
Q
Q
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
50-Pin TSOP
ARCHITECTURE
1 Meg x 16
512K x 16 x 2 banks
1 Meg x 16
2K (A0-A10)
256 (A0-A7)
2K or 4K
2 (BA)
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
16Mb: x16
©1999, Micron Technology, Inc.
SDRAM
Vss
DQ15
DQ14
VssQ
DQ13
DQ12
V
DQ11
DQ10
VssQ
DQ9
DQ8
V
NC
DQMH
CLK
CKE
NC
A9
A8
A7
A6
A5
A4
Vss
DD
DD
Q
Q

Related parts for MT48LC1M16A1TG-7S

MT48LC1M16A1TG-7S Summary of contents

Page 1

... Plastic Package - OCPL* 50-pin TSOP (400 mil) • Timing (Cycle Time) 6ns (166 MHz) 7ns (143 MHz) 8ns (125 MHz) • Refresh with Self Refresh Mode at 64ms Part Number Example: MT48LC1M16A1TG-7S KEY TIMING PARAMETERS SPEED CLOCK ACCESS TIME CL = 3** -6 166 MHz 5.5ns ...

Page 2

GENERAL DESCRIPTION (continued) locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select ...

Page 3

TABLE OF CONTENTS Functional Block Diagram - 1 Meg x 16 ................. 3 Pin Descriptions ........................................................ 4 Functional Description ........................................ 5 Initialization ........................................................ 5 Register Definitions ............................................. 5 Mode Register ................................................ 5 Burst Length .............................................. 5 Burst Type ................................................. 5 ...

Page 4

CKE CLK CONTROL CS# LOGIC WE# CAS# RAS# MODE REGISTER 12 REFRESH ADDRESS CONTROLLER A0-A10 REGISTER REFRESH 11 COUNTER 11 16Mb: x16 SDRAM 16MSDRAMx16.p65 – Rev. 8/99 FUNCTIONAL BLOCK DIAGRAM 1 Meg x 16 SDRAM ROW- MEMORY 11 ...

Page 5

PIN DESCRIPTIONS PIN NUMBERS SYMBOL 35 CLK 34 CKE 18 CS# 15, 16, 17 WE#, CAS#, RAS# 14, 36 DQML, DQMH 19 BA 21-24, 27-32, 20 A0-A10 DQ0- 11, 12, 39, 40, 42, DQ15 ...

Page 6

FUNCTIONAL DESCRIPTION In general, the SDRAM is a dual 512K x 16 DRAM that operates at 3.3V and includes a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the 512K x ...

Page 7

BA A10 Reserved Mode CAS Latency BT *Should program M11, M10 = ensure compatibility with future devices ...

Page 8

CAS Latency The CAS latency is the delay, in clock cycles, be- tween the registration of a READ command and the availability of the first piece of output data. The la- tency can be set ...

Page 9

COMMANDS Truth Table 1 provides a quick reference of available commands. This is followed by a written description of each command. Three additional Truth Tables appear TRUTH TABLE 1 – COMMANDS AND DQM OPERATION (Notes: 1) NAME (FUNCTION) COMMAND INHIBIT ...

Page 10

COMMAND INHIBIT The COMMAND INHIBIT function prevents new commands from being executed by the SDRAM, re- gardless of whether the CLK signal is enabled. The SDRAM is effectively deselected. Operations already in progress are not affected. NO OPERATION (NOP) The ...

Page 11

AUTO PRECHARGE ensures that the PRECHARGE is initiated at the earliest valid stage within a burst. The user must not issue another command to the same bank t until the precharge time ( RP) is completed. This is determined as ...

Page 12

OPERATION BANK/ROW ACTIVATION Before any READ or WRITE commands can be issued to a bank within the SDRAM, a row in that bank must be “opened.” This is accomplished via the AC- TIVE command, which selects both the bank and ...

Page 13

READS READ bursts are initiated with a READ command, as shown in Figure 5. The starting column and bank addresses are pro- vided with the READ command and AUTO PRECHARGE is either enabled or disabled for that burst access. If ...

Page 14

CAS latency minus one. This is shown in Figure 7 for READ latencies of one, two and three; data element either the last of a burst of four ...

Page 15

CLK COMMAND ADDRESS DQ CAS Latency = 1 CLK COMMAND ADDRESS DQ CLK COMMAND ADDRESS DQ NOTE: Each READ command may be to either bank. DQM is LOW. 16Mb: x16 SDRAM 16MSDRAMx16.p65 – Rev. 8/ READ ...

Page 16

Data from any READ burst may be truncated with a subsequent WRITE command, and data from a fixed-length READ burst may be immediately followed by data from a subsequent WRITE command (subject to bus turnaround limitations). The WRITE burst may ...

Page 17

A fixed-length READ burst may be followed by, or truncated with, a PRECHARGE command to the same bank (provided that AUTO PRECHARGE was not activated) and a full-page burst may be truncated with a PRECHARGE command to the same bank. ...

Page 18

PRECHARGE command is that it requires that the command and address buses be available at the appropriate time to issue the command; the advantage of the PRECHARGE command is that it can be used to truncate fixed-length ...

Page 19

WRITEs WRITE bursts are initiated with a WRITE com- mand, as shown in Figure 13. The starting column and bank addresses are pro- vided with the WRITE command and AUTO PRECHARGE is either enabled or disabled for that access. If ...

Page 20

Figure 16. Data for any WRITE burst may be truncated with a subsequent READ command, and data for a fixed- length WRITE burst may be immediately followed by ...

Page 21

Fixed-length or full-page WRITE bursts can be trun- cated with the BURST TERMINATE command. When truncating a WRITE burst, the input data applied coincident with the BURST TERMINATE command will be ignored. The last data written (provided that DQM is ...

Page 22

CLOCK SUSPEND The clock suspend mode occurs when a column access/burst is in progress and CKE is registered LOW. In the clock suspend mode, the internal clock is deacti- vated, “freezing” the synchronous logic. For each positive clock edge on ...

Page 23

CONCURRENT AUTO PRECHARGE An access command (READ or WRITE) to another bank while an access command with AUTO PRECHARGE enabled is executing is not allowed by SDRAMs, unless the SDRAM supports CONCURRENT AUTO PRECHARGE. Micron SDRAMs support CON- CURRENT AUTO ...

Page 24

WRITE with AUTO PRECHARGE 3. Interrupted by a READ (with or without AUTO PRECHARGE): A READ to bank m will interrupt a WRITE on bank n when registered, with the data- out appearing CAS latency later. The PRECHARGE t to ...

Page 25

TRUTH TABLE 2 – CKE (Notes: 1-4) CKE CKE CURRENT STATE n Power-Down Self Refresh Clock Suspend L H Power-Down Self Refresh Clock Suspend H L All Banks Idle All Banks Idle Reading or Writing H H ...

Page 26

TRUTH TABLE 3 – CURRENT STATE BANK n - COMMAND TO BANK n (Notes: 1-6; notes appear below and on next page) CURRENT STATE CS# RAS# CAS# WE# Any Idle L ...

Page 27

NOTE (continued): 5. The following states must not be interrupted by any executable command; COMMAND INHIBIT or NOP commands must be applied on each positive clock edge during these states. Refreshing: Starts with registration of an AUTO REFRESH command and ...

Page 28

TRUTH TABLE 4 – CURRENT STATE BANK n - COMMAND TO BANK m (Notes: 1-6; notes appear below and on next page) CURRENT STATE CS# RAS# CAS# WE# Any Idle Row ...

Page 29

NOTE (continued): 4. AUTO REFRESH, SELF REFRESH and LOAD MODE REGISTER commands may only be issued when all banks are idle BURST TERMINATE command cannot be issued to another bank; it applies to the bank represented by the ...

Page 30

ABSOLUTE MAXIMUM RATINGS* Voltage Supply DD DD Relative to V ....................................... -1V to +4.6V SS Voltage on Inputs I/O Pins Relative to V ....................................... -1V to +4.6V SS Operating Temperature, T (ambient) .. ...

Page 31

CAPACITANCE PARAMETER Input Capacitance: CLK Input Capacitance: All other input-only pins Input/Output Capacitance: DQs ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS (Notes 11) (0°C ≤ T ≤ +70° CHARACTERISTICS PARAMETER Access time from CLK ...

Page 32

AC FUNCTIONAL CHARACTERISTICS (Notes 11) (0°C ≤ T PARAMETER READ/WRITE command to READ/WRITE command CKE to clock disable or power-down entry mode CKE to clock enable or power-down exit setup mode DQM to input data ...

Page 33

NOTES 1. All voltages referenced This parameter is sampled MHz 25° dependent on output loading and cycle rates. DD Specified values are obtained with minimum ...

Page 34

INITIALIZE AND LOAD MODE REGISTER CLK ( ( CKH t CKS ( ( ( ( ) ) ) ) CKE ( ( ( ( ) ...

Page 35

CLK CKE t CKS t CKH t CMS t CMH COMMAND PRECHARGE 2 DQM ADDRESS BANK(S) High-Z DQ Two clock cycles Precharge all All banks idle, enter active banks. power-down mode. TIMING ...

Page 36

CLK t CKS t CKH CKE t CKS t CKH t CMS t CMH COMMAND READ NOP t CMS t CMH 3 DQM COLUMN m A0-A9 2 (A0 - A7) ...

Page 37

T0 T1 CLK t CK CKE t CKS t CKH t CMS t CMH COMMAND PRECHARGE NOP 1 DQM ADDRESS BANK(S) High Precharge all active banks. TIMING PARAMETERS -6 -7 SYMBOL* MIN MAX ...

Page 38

T0 T1 CLK t CK CKE t CKS t CKH t CMS t CMH COMMAND PRECHARGE NOP 1 DQM ADDRESS BANK(S) High Precharge all active banks. TIMING PARAMETERS -6 -7 SYMBOL* MIN MAX ...

Page 39

SINGLE READ – WITHOUT AUTO PRECHARGE CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM / DQML, DQMH A0-A9, A11 ROW ROW A10 ...

Page 40

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS 3 DQM A0-A9 ROW ROW A10 DISABLE AUTO PRECHARGE t AS ...

Page 41

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS 3 DQM A0-A9 ROW ENABLE AUTO PRECHARGE ROW A10 t AS ...

Page 42

ALTERNATING BANK READ ACCESSES CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS 3 DQM A0-A9 ROW ENABLE AUTO PRECHARGE ...

Page 43

CLK CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP READ t CMS 3 DQM COLUMN m A0-A9 ROW ( ...

Page 44

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP 3 DQM A0-A9 ROW ENABLE AUTO PRECHARGE ROW A10 DISABLE AUTO PRECHARGE ...

Page 45

SINGLE WRITE – WITHOUT AUTO PRECHARGE T0 CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE DQM / DQML, DQMH A0-A9, A11 ROW ROW A10 ...

Page 46

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS 3 DQM A0-A9 ROW ROW A10 DISABLE AUTO PRECHARGE ...

Page 47

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS 3 DQM A0-A9 ROW ENABLE AUTO PRECHARGE ROW A10 ...

Page 48

ALTERNATING BANK WRITE ACCESSES CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS 3 DQM A0-A9 ROW ENABLE AUTO PRECHARGE ROW A10 ...

Page 49

CLK CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP 2 DQM A0-A9 ROW ROW A10 BANK DQ ...

Page 50

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP 3 DQM A0-A9 ROW ROW A10 BANK DQ t RCD ...

Page 51

TYP PIN # 1.00 (2X) NOTE: 1. All dimensions in millimeters MAX or typical where noted. 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.01" per side. ...

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