MBM29F200BA-70PFTN Fujitsu, MBM29F200BA-70PFTN Datasheet

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MBM29F200BA-70PFTN

Manufacturer Part Number
MBM29F200BA-70PFTN
Description
CMOS 2M (256K x 8/128K x 16) FLASH MEMORY
Manufacturer
Fujitsu
Datasheet
FUJITSU SEMICONDUCTOR
FLASH MEMORY
CMOS
2M ( 256K 8/128K 16 )
MBM29F200TA/MBM29F200BA
Embedded Erase
• Single 5.0 V read, write, and erase
• Compatible with JEDEC-standard commands
• Compatible with JEDEC-standard word-wide pinouts
• Minimum 100,000 write/erase cycles
• High performance
• Sector erase architecture
• Boot Code Sector Architecture
• Embedded Erase
• Embedded Program
• Data Polling and Toggle Bit feature for detection of program or erase cycle completion
• Low power consumption
• Low Vcc write inhibit
• Sector protection
• Temporary sector unprotection
• Erase Suspend/Resume
DISTINCTIVE CHARACTERISTICS
Minimizes system level power requirements
Uses same software commands as E
48-pin TSOP (Package suffix: PFTN – Normal Bend Type, PFTR – Reversed Bend Type)
44-pin SOP (Package suffix: PF)
70 ns maximum access time
One 16K byte, two 8K bytes, one 32K byte, and three 64K bytes.
Any combination of sectors can be concurrently erased. Also supports full chip erase.
T=Top sector
B=Bottom sector
Automatically pre-programs and erases the chip or any sector
Automatically write and verifies data at specified address
20 mA typical active read current for Byte Mode
28 mA typical active read current for Word Mode
30 mA typical write/erase current
25 A typical standby current
Hardware method disables any combination of sectors from write or erase operations
Hardware method temporarily enable any combination of sectors from write or erase operations
Suspends the erase operation to allow a read in another sector within the same device
DATA SHEET
and Embedded Program
Algorithms
Algorithms
3.2 V
are trademarks of Advanced Micro Devices, Inc.
2
PROMs
DS05–20813–2E

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MBM29F200BA-70PFTN Summary of contents

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... FUJITSU SEMICONDUCTOR DATA SHEET FLASH MEMORY CMOS 2M ( 256K 8/128K 16 ) MBM29F200TA/MBM29F200BA DISTINCTIVE CHARACTERISTICS • Single 5.0 V read, write, and erase Minimizes system level power requirements • Compatible with JEDEC-standard commands Uses same software commands as E • Compatible with JEDEC-standard word-wide pinouts 48-pin TSOP (Package suffix: PFTN – Normal Bend Type, PFTR – Reversed Bend Type) 44-pin SOP (Package suffix: PF) • ...

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MBM29F200TA/200BA PACKAGE Marking side (FPT-48P-M19) 48-pin TSOP 2 Marking side (FPT-48P-M20) Marking side (FPT-44P-M16) 44-pin SOP ...

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... RY/ BY pin. Once the end of a program or erase cycle has been completed, the 6 device internally resets to the read mode. Fujitsu's Flash technology combines years of EPROM and E quality, reliability and cost effectiveness. The MBM29F200TA/BA memory electrically erases the entire chip or all bits within a sector simultaneously via Fowler-Nordhiem tunneling. The bytes/words are programmed one byte/ word at a time using the EPROM programming mechanism of hot electron injection ...

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... MBM29F200TA Sector Architecture 4 3FFFFh 64K byte 3BFFFh 64K byte 39FFFh 64K byte 37FFFh 32K byte 2FFFFh 8K byte 1FFFFh 8K byte 0FFFFh 16K byte MBM29F200BA Sector Architecture 3FFFFh 2FFFFh 1FFFFh 0FFFFh 07FFFh 05FFFh 03FFFh ...

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PRODUCT SELECTOR GUIDE Family Part No Ordering Part 5 5.0 V 10% CC Max Access Time (ns) CE Access (ns) OE Access (ns) BLOCK DIAGRAM RY/BY Buffer ...

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... FPT-48P-M19 A 24 (Marking Side N.C. 17 N.C. 16 RY/BY 15 N.C. 14 MBM29F200TA/MBM29F200BA N.C. 13 Reverse Pinout RESET N. FPT-48P-M20 6 SOP (Top View) ...

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LOGIC SYMBOL A RESET RY/BY BYTE MBM29F200TA/200BA Table 1 MBM29F200TA/BA Pin Configuration Pin Function A- Address Inputs ...

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MBM29F200TA/200BA ORDERING INFORMATION Standard Products FJ standard products are available in several packages. The order number is formed by a combination of: MBM29F200 TA –70 PFTN DEVICE NUMBER/DESCRIPTION MBM29F200 2 Mega-bit (256K 5.0 V-only Read, Write, and Erase 8 PACKAGE ...

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Table 2 MBM29F200TA/BA User Bus Operations (BYTE = V Operation Auto-Select Manufacturer Code (1) Auto-Select Device Code (1) Read (3) Standby Output Disable Write Enable Sector Protection (2) Verify Sector Protection (2) Temporary Sector Unprotection Reset (Hardware)/Standby Table 3 MBM29F200TA/BA ...

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... 51H and MBM29F200BA = 57H for x8 mode; MBM29F200TA = 2251H and MBM29F200BA = 2257H for x16 mode). All identifires for manufacturer and device will exhibit odd parity with DQ to read the proper device codes when executing the autoselect output from the device is disabled ...

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... Type Code DQ Manufacturer's Code 04H MBM29F200TA (B) 51H (W) 2251H Device Code MBM29F200BA (B) 57H 2257H (W) Sector Protection 01H (B): Byte mode (W): Word mode Write Device erasure and programming are accomplished via the command register. The contents of the register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device. ...

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MBM29F200TA/200BA To activate this mode, the programming equipment must force 11.5 V and The sector addresses ( protected. Tables 5 and 6 define ...

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... Table 5 Sector Address Tables (MBM29F200TA) Sector A16 A15 Address SA0 0 0 SA1 0 1 SA2 1 0 SA3 1 1 SA4 1 1 SA5 1 1 SA6 1 1 Table 6 Sector Address Tables (MBM29F200BA) Sector A16 A15 Address SA0 0 0 SA1 0 0 SA2 0 0 SA3 0 0 SA4 0 1 SA5 1 0 SA6 1 1 ...

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MBM29F200TA/200BA Table 7 MBM29F200TA/BA Command Definitions Bus First Bus Write Write Cycle Command Cycles Sequence Req'd Addr Word Read/Reset* 1 XXXH Byte Word 5555H Read/Reset* 3 Byte AAAAH Word 5555H Autoselect 3 Byte AAAAH Word 5555H Program 4 Byte AAAAH ...

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... XX00H retrieves the manufacture code of 04H. A read cycle from address XX01H for x16 (XX02H for x8)returns the device code (MBM29F200TA = 51H and MBM29F200BA = 57H for x8 mode; MBM29F200TA = 2251H and MBM29F200BA = 2257H for x16 mode). (See Tables 4.1 and 4.2.) All manufacturer and device codes will exhibit odd parity with DQ Sector state (protection or unprotection) will be informed by address XX02H for x16 (XX04H for x8) ...

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MBM29F200TA/200BA Chip Erase Chip erase is a six bus cycle operation. There are two “unlock” write cycles. These are followed by writing the “set- up” command. Two more “unlock” write cycles are then followed by the chip erase command. Chip ...

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... DQ = Don’t Care for 16 mode for Fujitsu internal use only Data Polling The MBM29F200TA/BA device features Data Polling as a method to indicate to the host that the Embedded Algorithms are in progress or completed. During the Embedded Program Algorithm an attempt to read the device ...

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MBM29F200TA/200BA For chip erase, the Data Polling is valid after the rising edge of the sixth WE pulse in the six write pulse sequence. For sector erase, the Data Polling is valid after the last rising edge of the sector ...

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DQ 3 Sector Erase Timer After the completion of the initial sector erase command sequence the sector erase time-out will begin. DQ remain low until the time-out is complete. Data Polling and Toggle Bit are valid after the initial sector ...

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MBM29F200TA/200BA operation and hence commands are written and 13 for the timing diagram. Data Protection The MBM29F200TA/BA is designed to offer protection against accidental erasure or programming caused by spurious system level signals that may exist during ...

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ABSOLUTE MAXIMUM RATINGS Storage Temperature ..........................................................................................– +125 C Ambient Temperature with Power Applied ..........................................................– +85 C Voltage with Respect to Ground All pins except A V (Note 1) ........................................................................................................–2 +7 ...

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MBM29F200TA/200BA MAXIMUM OVERSHOOT +0.8 V –0.5 V –2.0 V Figure 1 Maximum Negative Overshoot Waveform +2.0 V Figure 2 Maximum Positive Overshoot Waveform +13.5 V +13 +0 *:This ...

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DC CHARACTERISTICS • TTL/NMOS Compatible Parameter Parameter Description Symbol I LI Input Leakage Current I Output Leakage Current LO I LIT A , OE, RESET Inputs Leakage Current Active Current (Note 1) CC1 CC I CC2 V ...

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MBM29F200TA/200BA DC CHARACTERISTICS (continued) • CMOS Compatible Parameter Parameter Description Symbol I Input Leakage Current LI I Output Leakage Current OE, RESET Inputs Leakage 9 I LIT Current I V Active Current (Note 1) CC1 CC I ...

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AC CHARACTERISTICS • Read Only Operations Characteristics Parameter Symbols Description Stan- JEDEC dard t t Read Cycle Time AVAV RC t Address to Output Delay t AVQV ACC t Chip Enable to Output Delay t ELQV Output ...

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MBM29F200TA/200BA Device Under Test Note: For –70 including jig capacitance L For all others 100 pF including jig capacitance L • Write/Erase/Program Operations Alternate WE Controlled Writes Parameter Symbols JEDEC Standard t Write Cycle ...

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Parameter Symbols JEDEC Standard t t Read Recover Time Before Write GHWL GHWL Setup Time CS ELWL Hold Time CH WHEH t t Write Pulse Width WP WLWH t t Write Pulse Width ...

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MBM29F200TA/200BA • Write/Erase/Program Operations Alternate CE Controlled Writes Parameter Symbols JEDEC Standard t Write Cycle Time t AVAV Address Setup Time AVEL Address Hold Time ELAX AH t Data Setup Time t DVEH DS ...

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SWITCHING WAVEFORMS • Key to Switching Waveforms WAVEFORM Addresses OEH WE High-Z Outputs Figure 5 AC Waveforms for Read Operations MBM29F200TA/200BA INPUTS OUTPUTS Must Be Will Be Steady Steady May Will Be Change Changing from H to ...

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MBM29F200TA/200BA 3rd Bus Cycle Addresses 5555H GHWL A0H Data t DS 5.0V Notes address of the memory location to be programmed data to be programmed at ...

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Addresses A0H Data t DS 5.0V Notes address of the memory location to be programmed data to be programmed at byte address. 3. ...

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MBM29F200TA/200BA Addresses 5555H CE t GHWL Data AAH VCS Notes the sector address for Sector Erase. Addresses = 5555H (Word), AAAAH (Byte) for Chip Erase. 2. These ...

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OEH Valid Data (The device has completed the Embedded operation). *DQ 7 Figure 9 AC Waveforms for Data Polling during Embedded Algorithm Operations CE t OEH ...

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MBM29F200TA/200BA CE WE RY/BY Figure 11 RY/BY Timing Diagram During Program/Erase Operations CE RY/BY RESET Figure 12 RESET/RY/BY Timing Diagram 34 The rising edge of the last WE signal Entire programming or erase operations t BUSY READY ...

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CE OE BYTE t ELFL t ELFH /A–1 15 Figure 13 BYTE Timing Diagram for Read Operations CE WE BYTE Figure 14 BYTE Timing Diagram for Write Operations MBM29F200TA/200BA Data Output Data Output (DQ ...

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MBM29F200TA/200BA SAX 12V VLHT 12V VLHT WE t OESP t CSP CE Data SAX = Sector Address for initial sector SAY = ...

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RESET VLHT RY/BY Figure 16 Temporary Sector Unprotection MBM29F200TA/200BA Program or Erase Command Sequence ...

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MBM29F200TA/200BA EMBEDDED ALGORITHMS Increment Address Program Command Sequence* (Address/Command The sequence is applied for x16 mode. The addresses differ from x8 mode. Figure 17 Embedded Programming Algorithm Table 9 Embedded Programming Algorithm Bus Operations Standby* Write Read Standby* ...

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EMBEDDED ALGORITHMS Chip Erase Command Sequence* (Address/Command): 5555H/AAH 2AAAH/55H 5555H/80H 5555H/AAH 2AAAH/55H 5555H/10H * : The sequence is applied for x16 mode. The addresses differ from x8 mode. Figure 18 Embedded Erase Algorithm Table 10 Embedded Erase Algorithm Bus Operations ...

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MBM29F200TA/200BA Note rechecked even Start VA = Address for programming Read Byte ( Addr = VA Yes DQ = Data Yes Read ...

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DQ No (DQ DQ Note rechecked even changing to “1” . Figure 20 Toggle Bit Algorithm MBM29F200TA/200BA Start Read Byte VA = Address for programming Any of ...

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MBM29F200TA/200BA Increment PLSCNT NO PLSCNT = 25? YES Remove V From Write Reset Command Device Failed Figure 21 Sector Protection Algorithm 42 Start Set Up Sector Addr ( ...

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Start RESET = V (Note 1) Perform Erase or Program Operations RESET = V Temporary Sector Group Unprotect Completed (Note 2) NOTES: 1. All protected sectors unprotected. 2. All previously protected sectors are protected once again. Figure 22 Temporary Sector ...

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MBM29F200TA/200BA ERASE AND PROGRAMMING PERFORMANCE Parameter Min. Sector Erase Time Byte Programming Time Chip Programming Time Erase/Program Cycle 100,000 TSOP PIN CAPACITANCE Parameter Parameter Description Symbol C Input Capacitance IN C Output Capacitance OUT C Control Pin Capacitance IN2 Note: ...

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... Standard Thin Small Outline Package (measured in inches) LEAD No. 1 INDEX 24 20.00±0.20 (.787±.008) * 18.40±0.20 (.724±.008) 0.10(.004) 19.00±0.20 (.748±.008) 1994 FUJITSU LIMITED F48029S-1C-1 C MBM29F200TA/200BA +.010 –.008 23 13.00±0.10 16.00±0.20 (.512±.004) (.630±.008) "A" 22 +0.10 0(0)MIN – ...

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... Reversed Thin Small Outline Package (measured in inches) LEAD No. 1 INDEX 24 19.00±0.20 (.748±.008) 0.10(.004) * 18.40±0.20 (.724±.008) 20.00±0.20 (.787±.008) 1994 FUJITSU LIMITED F48030S-1C Details of "A" part 0.15(.006) MAX 0.35(.014) "A" MAX 0.15(.006) 0.25(.010) 25 0.50± ...

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... Information sufficient for construction purposes is not nec- essarily given. The information contained in this document has been carefully checked and is believed to be reliable. However, Fujitsu as- sumes no responsibility for inaccuracies. The information contained in this document does not convey any license under the copyrights, patent rights or trademarks claimed and owned by Fujitsu ...

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