HM5212165FTD-A60 HITACHI, HM5212165FTD-A60 Datasheet

no-image

HM5212165FTD-A60

Manufacturer Part Number
HM5212165FTD-A60
Description
Manufacturer
HITACHI
Datasheet
Description
The Hitachi HM5212165F is a 128-Mbit SDRAM organized as 2097152-word
Hitachi HM5212805F is a 128-Mbit SDRAM organized as 4194304-word
outputs are referred to the rising edge of the clock input. It is packaged in standard 54-pin plastic TSOP II.
Features
3.3 V power supply
Clock frequency: 133 MHz/100 MHz (max)
LVTTL interface
Single pulsed RAS
4 banks can operate simultaneously and independently
Burst read/write operation and burst read/single write operation capability
Programmable burst length: 1/2/4/8/full page
2 variations of burst sequence
Programmable CAS latency: 2/3
Byte control by DQM : DQM (HM5212805F)
Refresh cycles: 4096 refresh cycles/64 ms
Sequential (BL = 1/2/4/8/full page)
Interleave (BL = 1/2/4/8)
2-Mword 16-bit 4-bank/4-Mword 8-bit 4-bank
HM5212165F-75/A60/B60
HM5212805F-75/A60/B60
: DQMU/DQML (HM5212165F)
128M LVTTL interface SDRAM
PC/133, PC/100 SDRAM
133 MHz/100 MHz
8-bit
ADE-203-1048A (Z)
4-bank. All inputs and
16-bit
Jan. 31, 2000
4-bank. The
Rev. 1.0

Related parts for HM5212165FTD-A60

HM5212165FTD-A60 Summary of contents

Page 1

... LVTTL interface SDRAM 2-Mword 16-bit 4-bank/4-Mword 8-bit 4-bank Description The Hitachi HM5212165F is a 128-Mbit SDRAM organized as 2097152-word Hitachi HM5212805F is a 128-Mbit SDRAM organized as 4194304-word outputs are referred to the rising edge of the clock input packaged in standard 54-pin plastic TSOP II. ...

Page 2

... HM5212165F/HM5212805F-75/A60/B60 2 variations of refresh Auto refresh Self refresh Full page burst length capability Sequential burst Burst stop capability Ordering Information Type No. Frequency 1 HM5212165FTD-75* 133 MHz HM5212165FTD-A60 100 MHz 2 HM5212165FTD-B60* 100 MHz 1 HM5212165FLTD-75* 133 MHz HM5212165FLTD-A60 100 MHz 2 HM5212165FLTD-B60* 100 MHz 1 HM5212805FTD-75* ...

Page 3

Pin Arrangement (HM5212165F) Pin Description Pin name Function A0 to A13 Address input Row address Column address Bank select address A12/A13 (BS) V DQ0 to DQ15 Data-input/output CS Chip select RAS Row address strobe command CAS Column address strobe command ...

Page 4

HM5212165F/HM5212805F-75/A60/B60 Pin Arrangement (HM5212805F) Pin Description Pin name Function A0 to A13 Address input Row address Column address Bank select address A12/A13 (BS) V DQ0 to DQ7 Data-input/output CS Chip select RAS Row address strobe command CAS Column address strobe ...

Page 5

Block Diagram (HM5212165F) Column address counter Row decoder Memory array Bank0 4096 row 512 column 8 bit Memory array Bank0 4096 row 512 column 8 bit Row decoder Column address counter HM5212165F/HM5212805F-75/A60/B60 A0 to A13 A0 to A13 A0 to ...

Page 6

HM5212165F/HM5212805F-75/A60/B60 Block Diagram (HM5212805F) Column address counter Row decoder Memory array Bank0 4096 row 1024 column 4 bit Memory array Bank0 4096 row 1024 column 4 bit Row decoder Column address counter A13 A0 to A13 A0 ...

Page 7

Pin Functions CLK (input pin): CLK is the master clock input to this pin. The other input signals are referred at CLK rising edge. CS (input pin): When CS is Low, the command input cycle becomes valid. When CS is ...

Page 8

HM5212165F/HM5212805F-75/A60/B60 Command Operation Command Truth Table The SDRAM recognizes the following commands specified by the CS, RAS, CAS, WE and address pins. Command Ignore command No operation Burst stop in full page Column address and read command READ Read with ...

Page 9

Column address strobe and write command [WRIT]: This command starts a write operation. When the burst write mode is selected, the column address (AY0 to AY8; HM5212165F, AY0 to AY9; HM5212805F) and the bank select address (A12/A13) become the burst ...

Page 10

HM5212165F/HM5212805F-75/A60/B60 DQM Truth Table (HM5212165F) Command Upper byte (DQ8 to DQ15) write enable/output enable ENBU Lower byte (DQ0 to DQ7) write enable/output enable Upper byte (DQ8 to DQ15) write inhibit/output disable MASKU Lower byte (DQ0 to DQ7) write inhibit/output disable ...

Page 11

CKE Truth Table Current state Command Active Clock suspend mode entry Any Clock suspend Clock suspend Clock suspend mode exit Idle Auto-refresh command (REF) Idle Self-refresh entry (SELF) Idle Power down entry Self refresh Self refresh exit (SELFX) Power down ...

Page 12

HM5212165F/HM5212805F-75/A60/B60 Self-refresh entry [SELF]: When this command is input during the IDLE state, the SDRAM starts self- refresh operation. After the execution of this command, self-refresh continues while CKE is Low. Since self- refresh is performed internally and automatically, external ...

Page 13

CS RAS Current state Row active Read ...

Page 14

HM5212165F/HM5212805F-75/A60/B60 CS RAS Current state Write Write with auto- H precharge ...

Page 15

From PRECHARGE state, command operation To [DESL], [NOP] or [BST]: When these commands are executed, the SDRAM enters the IDLE state after t has elapsed from the completion of precharge. RP From IDLE state, command operation To [DESL], [NOP], [BST], ...

Page 16

HM5212165F/HM5212805F-75/A60/B60 From READ with AUTO-PRECHARGE state, command operation To [DESL], [NOP]: These commands continue read operations until the burst operation is completed, and the SDRAM then enters precharge mode. To [ACTV]: This command makes other banks bank active. (However, an ...

Page 17

Simplified State Diagram WRITE SUSPEND WRITEA SUSPEND POWER APPLIED Automatic transition after completion of command. Transition resulting from command input. Note: 1. After the auto-refresh operation, precharge operation is performed automatically and enter the IDLE state. HM5212165F/HM5212805F-75/A60/B60 SR ENTRY MRS ...

Page 18

HM5212165F/HM5212805F-75/A60/B60 Mode Register Configuration The mode register is set by the input to the address pins (A0 to A13) during mode register set cycles. The mode register consists of five sections, each of which is assigned to address pins. A13, ...

Page 19

Burst Sequence Burst length = 2 Starting Ad. Addressing(decimal) A0 Sequential Burst length = 8 Starting Ad. Addressing(decimal Sequential ...

Page 20

HM5212165F/HM5212805F-75/A60/B60 Operation of the SDRAM Read/Write Operations Bank active: Before executing a read or write operation, the corresponding bank and the row address must be activated by the bank active (ACTV) command. Bank 0, bank 1, bank 2 or bank ...

Page 21

Burst Length CLK t RCD Command READ ACTV Address Row Column Dout full page Write operation: Burst write or single write mode is selected by the ...

Page 22

HM5212165F/HM5212805F-75/A60/B60 2. Single write: A single write operation is enabled by setting OPCODE (A9, A8) to (1, 0 single write operation, data is only written to the column address (AY0 to AY8; HM5212165F, AY0 to AY9; HM5212805F) and ...

Page 23

Write with auto-precharge: In this operation, since precharge is automatically performed after completing a burst write or single write operation, a precharge command need not be executed after each write operation. The command executed for the same bank after the ...

Page 24

HM5212165F/HM5212805F-75/A60/B60 Full-page Burst Stop Burst stop command during burst read: The burst stop (BST) command is used to stop data output during a full-page burst. The BST command sets the output buffer to High-Z and stops the full-page burst read. ...

Page 25

Burst stop command at burst write: The burst stop command (BST command) is used to stop data input during a full-page burst write. No data is written in the same clock as the BST command, and in subsequent clocks. In ...

Page 26

HM5212165F/HM5212805F-75/A60/B60 Command Intervals Read command to Read command interval: 1. Same bank, same ROW address: When another read command is executed at the same ROW address of the same bank as the preceding read command execution, the second read can ...

Page 27

Write command to Write command interval: 1. Same bank, same ROW address: When another write command is executed at the same ROW address of the same bank as the preceding write command, the second write can be performed after an ...

Page 28

HM5212165F/HM5212805F-75/A60/B60 Read command to Write command interval: 1. Same bank, same ROW address: When the write command is executed at the same ROW address of the same bank as the preceding read command, the write command can be performed after ...

Page 29

Write command to Read command interval: 1. Same bank, same ROW address: When the read command is executed at the same ROW address of the same bank as the preceding write command, the read command can be performed after an ...

Page 30

HM5212165F/HM5212805F-75/A60/B60 Read with auto precharge to Read command interval 1. Different bank: When some banks are in the active state, the second read command (another bank) is executed. Even when the first read with auto-precharge is a burst read that ...

Page 31

Read with auto precharge to Write command interval 1. Different bank: When some banks are in the active state, the second write command (another bank) is executed. However, DQM, DQMU/DQML must be set High so that the output buffer becomes ...

Page 32

HM5212165F/HM5212805F-75/A60/B60 Write with auto precharge to Read command interval 1. Different bank: When some banks are in the active state, the second read command (another bank) is executed. However,in case of a burst write, data will continue to be written ...

Page 33

Read command to Precharge command interval (same bank): When the precharge command is executed for the same bank as the read command that preceded it, the minimum interval between the two commands is one clock. However, since the output buffer ...

Page 34

HM5212165F/HM5212805F-75/A60/B60 READ to PRECHARGE Command Interval (same bank): To stop output data CAS Latency = 2, Burst Length = full page burst CLK READ Command Dout CAS Latency = 3, Burst Length = ...

Page 35

Write command to Precharge command interval (same bank): When the precharge command is executed for the same bank as the write command that preceded it, the minimum interval between the two commands is 1 clock. However, if the burst write ...

Page 36

HM5212165F/HM5212805F-75/A60/B60 Bank active command interval: 1. Same bank: The interval between the two bank-active commands must be no less than the case of different bank-active commands: The interval between the two bank-active commands must be no less ...

Page 37

Mode register set to Bank-active command interval: The interval between setting the mode register and executing a bank-active command must be no less than l CLK Command Address DQM Control The DQM mask the DQ data. The DQMU and DQML ...

Page 38

HM5212165F/HM5212805F-75/A60/B60 Reading CLK DQM, DQMU/DQML DQ (output) Writing CLK DQM, DQMU/DQML DQ (input) 38 High-Z out 0 out Latency DOD Latency DID out ...

Page 39

Refresh Auto-refresh: All the banks must be precharged before executing an auto-refresh command. Since the auto- refresh command updates the internal counter every time it is executed and determines the banks and the ROW addresses to be refreshed, external address ...

Page 40

HM5212165F/HM5212805F-75/A60/B60 Power up sequence CKE, DQM, Low DQMU/DQML Low CLK Low CS, DQ Absolute Maximum Ratings Parameter Voltage on any pin relative to V Supply voltage relative Short circuit ...

Page 41

V /V Clamp IL IH This SDRAM has V and Minimum V Clamp Current IL V (V) IL –2 –1.8 –1.6 –1.4 –1.2 –1 –0.9 –0.8 –0.6 –0.4 –0 –2 –5 –10 –15 –20 –25 ...

Page 42

HM5212165F/HM5212805F-75/A60/B60 Minimum V Clamp Current (referred ( 0.8 CC ...

Page 43

I /I Characteristics OL OH Output Low Current ( Vout (V) 0 0.4 0.65 0.85 1 1.4 1.5 1.65 1.8 1.95 3 3.45 250 200 150 100 0.5 HM5212165F/HM5212805F-75/A60/B60 I OL Min (mA ...

Page 44

HM5212165F/HM5212805F-75/A60/B60 Output High Current ( +70˚ Vout (V) 3.45 3.3 3 2.6 2.4 2 1.8 1.65 1.5 1 0.5 –100 –200 –300 –400 –500 –600 ...

Page 45

DC Characteristics ( +70˚C, V (HM5212165F) Parameter Symbol Operating current (CAS latency = 2) I CC1 (CAS latency = 3) I CC1 Standby current in I CC2P power down Standby current in I CC2PS power down (input ...

Page 46

HM5212165F/HM5212805F-75/A60/B60 DC Characteristics ( +70˚C, V (HM5212805F) Parameter Symbol Operating current (CAS latency = 2) I CC1 (CAS latency = 3) I CC1 Standby current in I CC2P power down Standby current in I CC2PS power down ...

Page 47

Notes depends on output load condition when the device is selected output open condition. 2. One bank operation. 3. Input signals are changed once per one clock. 4. Input signals are changed once per two clocks. ...

Page 48

... HM5212165F/HM5212805F-75/A60/B60 AC Characteristics ( +70˚C, V HITACHI Parameter Symbol System clock cycle time (CAS latency = 2) t (CAS latency = 3) t CLK high pulse width t CLK low pulse width t Access time from CLK (CAS latency = 2) t (CAS latency = 3) t Data-out hold time t CLK to Data-out low ...

Page 49

Notes measurement assumes t 2. Access time is measured at 1.5 V. Load condition pF (min) defines the time at which the outputs achieves the low impedance state (max) ...

Page 50

... Last data out to precharge (early precharge) (CAS latency = 2) (CAS latency = 3) Column command to column command Write command to data in latency DQM to data in DQM to data out CKE to CLK disable Register set to active command 50 HM5212165F/ HM5212805F -75 133 HITACHI PC/100 Symbol Symbol 7 RCD RAS ...

Page 51

... Burst stop to write data ignore Notes are recommended value. RCD RRD 2. Be valid [DESL] or [NOP] at next command of self refresh exit. 3. Except [DESL] and [NOP] HM5212165F/HM5212805F-75/A60/B60 HM5212165F/ HM5212805F -75 133 HITACHI PC/100 Symbol Symbol 7 CDD l 1 PEC l 1 BSR ...

Page 52

HM5212165F/HM5212805F-75/A60/B60 Timing Waveforms Read Cycle CKH CKL CLK V IH CKE t RCD RAS CAS ...

Page 53

Write Cycle CKH CKL CLK V IH CKE t RCD RAS CAS ...

Page 54

HM5212165F/HM5212805F-75/A60/B60 Mode Register Set Cycle 0 1 CLK V CKE IH CS RAS CAS WE BS Address valid DQM, DQMU/DQML DQ (output) DQ (input Precharge If needed Read Cycle/Write Cycle CLK V CKE IH ...

Page 55

Read/Single Write Cycle CLK V CKE IH CS RAS CAS WE BS Address R:a DQM, DQMU/DQML DQ (input) DQ (output) Bank 0 Active CKE RAS CAS WE BS R:a Address DQM, DQMU/DQML DQ (input) ...

Page 56

HM5212165F/HM5212805F-75/A60/B60 Read/Burst Write Cycle CLK CKE CS RAS CAS WE BS Address R:a DQM, DQMU/DQML DQ (input) DQ (output) Bank 0 Active CKE RAS CAS WE BS R:a Address DQM, DQMU/DQML DQ (input) DQ ...

Page 57

Full Page Read/Write Cycle CLK V CKE IH CS RAS CAS WE BS Address R:a C:a DQM, DQMU/DQML DQ (output) DQ (input) Bank 0 Bank 0 Active Read V CKE IH CS RAS CAS WE BS Address R:a C:a DQM, ...

Page 58

HM5212165F/HM5212805F-75/A60/B60 Auto Refresh Cycle CLK CKE RAS CAS WE BS Address A10=1 DQM, DQMU/DQML DQ (input) DQ (output Auto Refresh Precharge If needed Self Refresh Cycle CLK CKE CS RAS CAS WE ...

Page 59

Clock Suspend Mode CLK CKE CS RAS CAS WE BS Address R:a DQM, DQMU/DQML DQ (output) DQ (input) Bank0 Active clock Active suspend start CKE CS RAS CAS WE BS Address R:a DQM, DQMU/DQML DQ (output) ...

Page 60

HM5212165F/HM5212805F-75/A60/B60 Power Down Mode CLK CKE CS RAS CAS WE BS Address A10=1 DQM, DQMU/DQML DQ (input) DQ (output) Precharge command If needed Initialization Sequence 0 1 CLK CKE RAS CAS WE valid Address DQM ...

Page 61

... Package Dimensions HM5212165FTD/HM5212805FTD Series/ HM5212165FLTD/HM5212805FLTD Series (TTP-54DA) 22.22 22.72 Max 0.10 *0.30 – 0.05 0.28 0.05 0.91 Max 0.10 *Dimension including the plating thickness Base material dimension HM5212165F/HM5212805F-75/A60/B60 28 27 0.80 0.13 M 11.76 0.80 0.20 0 – 5 0.50 0.10 Hitachi Code TTP-54DA JEDEC — EIAJ — Weight (reference value) 0.58 g Unit ...

Page 62

... Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics ...

Page 63

Revision Record Rev. Date Contents of Modification 0.0 May. 17, 1999 Initial issue 1.0 Jan. 31, 2000 Deletion of preliminary CKE Truth table Clock suspend mode entry HM5212165F/HM5212805F-75/A60/B60 CS Addition of description to clock suspend mode entry Drawn ...

Related keywords