TZA3034T Philips Semiconductors, TZA3034T Datasheet

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TZA3034T

Manufacturer Part Number
TZA3034T
Description
SDH/SONET STM1/OC3 postamplifier.
Manufacturer
Philips Semiconductors
Datasheet

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Objective specification
File under Integrated Circuits, IC19
DATA SHEET
TZA3034T; TZA3034U
SDH/SONET STM1/OC3
postamplifiers
INTEGRATED CIRCUITS
1998 Jul 07

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TZA3034T Summary of contents

Page 1

... DATA SHEET TZA3034T; TZA3034U SDH/SONET STM1/OC3 postamplifiers Objective specification File under Integrated Circuits, IC19 INTEGRATED CIRCUITS 1998 Jul 07 ...

Page 2

... COMPENSATION RECTIFIER 1 k BAND GAP REFERENCE ( (1, 14) (11, 12) (13 SUB V CCA CF Fig.1 Block diagram. 2 Objective specification TZA3034T; TZA3034U 1.58 mm TZA3034 (24) 13 DOUT A2 A3 (23) 12 DOUTQ (16) 8 JAM (18 (17) 9 STQ (19, 20, 22, 25) (27, 28 DGND V CCD ...

Page 3

... DC voltage is V threshold level is set by connecting an external resistor between RSET and forcing a current into RSET; default value for this resistor is 180 k which corresponds with approximately 4 mV (p-p) differential input signal 3 Objective specification TZA3034T; TZA3034U DESCRIPTION (pin 14) CCD (pin 6) CCA CCA 1.5 V ...

Page 4

... DGND DOUTQ DOUT DGND TEST V CCD V CCD V ref RSET n.c. n.c. Note 1. Coordinates represent the position of the centre of the pad with respect to the centre of the die. 4 Objective specification TZA3034T; TZA3034U (1) COORDINATES PAD 235.7 +647.8 2 392.8 +647.8 3 532.8 +647.8 4 647.8 +507.1 5 647 ...

Page 5

... internal reference generator (see Fig.5). The TZA3034 can be DC coupled, but AC coupling is preferred. In case of DC coupling, the driving source must operate within the allowable input signal range (2 Objective specification TZA3034T; TZA3034U CCD 27 26 TEST ...

Page 6

... The output circuit of DOUT and DOUTQ is given in Fig.8. (the internal CCA Some PECL termination schemes are given in Fig.9. between DETECT A (1) 6 Objective specification TZA3034T; TZA3034U , the current flowing into this pin will be: CCA 1.5 = ----------------------- - A R DETECT for a given input signal DETECT ...

Page 7

... DIN 1998 Jul 07 V O(max) V OQH OQL O(min) Fig.4 Logic level symbol definitions for PECL 4.5 k 330 A 2.55 V Fig.5 Data input circuit DIN and DINQ. 7 Objective specification TZA3034T; TZA3034U o(p-p) MGR243 DINQ 4.5 k 330 A MGR244 ...

Page 8

... Jul 1.5 V MGR245 Fig.6 Level-detect input circuit RSET LOW V HIGH Fig.7 PECL output circuit ST and STQ 105 105 9 mA 0.5 mA Fig.8 PECL output circuit DOUT and DOUTQ. 8 Objective specification TZA3034T; TZA3034U RSET ST, STQ 10 k MGR246 DOUT DOUTQ 0.5 mA MGR247 ...

Page 9

... Jul 3 127 82.5 GND 5 83 125 GND Fig.9 PECL output termination schemes. 9 Objective specification TZA3034T; TZA3034U MGR248 R1 = 127 R2 = 82.5 MGR249 125 MGR250 ...

Page 10

... The numbers in brackets refer to the pad numbers of the naked die version. THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to solder point th(j-s) R thermal resistance from junction to ambient th(j-a) 1998 Jul 07 CONDITIONS note 1 note 1 PARAMETER 10 Objective specification TZA3034T; TZA3034U MIN. MAX. UNIT ...

Page 11

... V CCA V = 200 kHz square i wave electrically measured 20% to 80% 80% to 20% 11 Objective specification TZA3034T; TZA3034U MIN. TYP. MAX. 3 3.3 5 110 270 40 +120 40 +25 +85 0.002 1.0 0.004 2.0 2.1 2. 0.5 CCA ...

Page 12

... 20% to 80% 80 note 5 10 note 6 1.165 and pin RSET. The corresponding input signal CCA 12 Objective specification TZA3034T; TZA3034U TYP. MAX. 1840 V 1620 mV CC 1100 V 900 CC 600 200 V 1490 mV CC 1165 +10 1.20 1.235 UNIT mV ...

Page 13

... TZA3034 (1, 14) (16) (17) (18) (19, 20, 22, 25 AGND SUB JAM STQ ST Fig.10 Application diagram. 13 Objective specification TZA3034T; TZA3034U 100 nF V CCD 14 DOUT (24) 13 data out DOUTQ (23 DGND level-detect status MGR284 2 V ...

Page 14

Acrobat reader. white to force landscape pages to be ... ( DREF OUTQ 1 7 TZA3033T 31 pF IPhoto ...

Page 15

... Jul 2.5 scale (1) ( 0.49 0.25 10.0 4.0 1.27 0.36 0.19 9.8 3.8 0.0100 0.019 0.39 0.16 0.050 0.014 0.0075 0.38 0.15 REFERENCES JEDEC EIAJ MS-012AC 15 TZA3034T; TZA3034U detail 6.2 1.0 0.7 1.05 0.25 0.25 5.8 0.4 0.6 0.244 0.039 0.028 0.041 0.01 0.01 0.228 ...

Page 16

... C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes 1998 Jul 07 TZA3034T; TZA3034U Wave soldering Wave soldering techniques can be used for all SO packages if the following conditions are observed: A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used ...

Page 17

... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Jul 07 TZA3034T; TZA3034U 17 Objective specification ...

Page 18

... Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel ...

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