ISPLSI3320-70LQ Lattice Semiconductor Corp., ISPLSI3320-70LQ Datasheet

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ISPLSI3320-70LQ

Manufacturer Part Number
ISPLSI3320-70LQ
Description
Manufacturer
Lattice Semiconductor Corp.
Datasheet

Specifications of ISPLSI3320-70LQ

Case
QFP

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Price
Part Number:
ISPLSI3320-70LQ
Manufacturer:
TOSHIBA
Quantity:
1 200
• HIGH-DENSITY PROGRAMMABLE LOGIC
• HIGH-PERFORMANCE E
• ispLSI FEATURES:
• 100% IEEE 1149.1 BOUNDARY SCAN COMPATIBLE
• OFFERS THE EASE OF USE AND FAST SYSTEM
• ispDesignEXPERT™ – LOGIC COMPILER AND COM-
Copyright © 2003 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
3320_07
Features
— 160 I/O Pins
— 14000 PLD Gates
— 480 Registers
— High Speed Global Interconnect
— Wide Input Gating for Fast Counters, State
— Small Logic Block Size for Random Logic
— TTL Compatible Inputs and Outputs
— Electrically Erasable and Reprogrammable
— Non-Volatile
— 100% Tested at Time of Manufacture
— Unused Product Term Shutdown Saves Power
— 5V In-System Programmable (ISP™) Using Lattice
— Increased Manufacturing Yields, Reduced Time-to-
— Reprogram Soldered Devices for Faster Debugging
SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY
OF FIELD PROGRAMMABLE GATE ARRAYS
— Complete Programmable Device Can Combine Glue
— Enhanced Pin Locking Capability
— Five Dedicated Clock Input Pins
— Synchronous and Asynchronous Clocks
— Programmable Output Slew Rate Control to
— Flexible Pin Placement
— Optimized Global Routing Pool Provides Global
— Pin Compatible with ispLSI 3160
PLETE ISP DEVICE DESIGN SYSTEMS FROM HDL
SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
— Superior Quality of Results
— Tightly Integrated with Leading CAE Vendor Tools
— Productivity Enhancing Timing Analyzer, Explore
— PC and UNIX Platforms
Market, and Improved Product Quality
ISP or Boundary Scan Test (IEEE 1149.1) Protocol
Machines, Address Decoders, etc.
f
t
Logic and Structured Designs
Minimize Switching Noise
Interconnectivity
Tools, Timing Simulator and ispANALYZER™
max = 100 MHz Maximum Operating Frequency
pd = 10 ns Propagation Delay
2
CMOS
®
TECHNOLOGY
1
In-System Programmable High Density PLD
The ispLSI 3320 is a High-Density Programmable Logic
Device containing 480 Registers, 160 Universal I/O pins,
five Dedicated Clock Input Pins, ten Output Routing
Pools (ORP) and a Global Routing Pool (GRP) which
allows complete inter-connectivity between all of these
elements. The ispLSI 3320 features 5V in-system pro-
grammability and in-system diagnostic capabilities. The
ispLSI 3320 offers non-volatile reprogrammability of the
logic, as well as the interconnect to provide truly
reconfigurable systems.
The basic unit of logic on the ispLSI 3320 device is the
Twin Generic Logic Block (Twin GLB) labelled A0, A1...J3.
There are a total of 40 of these Twin GLBs in the ispLSI
3320 device. Each Twin GLB has 24 inputs, a program-
mable AND array and two OR/Exclusive-OR Arrays, and
eight outputs which can be configured to be either com-
binatorial or registered. All Twin GLB inputs come from
the GRP.
Functional Block Diagram
Description
Boundary
Scan
H0
H1
H2
H3
J0
J1
J2
J3
I0
I1
I2
I3
Output Routing Pool (ORP)
Output Routing Pool (ORP)
G3
A0
G2
A1
G1
A2
Global Routing Pool
ispLSI
G0
A3
(GRP)
Output Routing Pool (ORP)
Output Routing Pool (ORP)
F3
B0
Array
Array
OR
OR
F2
B1
D Q
D Q
D Q
D Q
D Q
D Q
D Q
D Q
F1
B2
December 2003
®
Twin
GLB
F0
B3
3320
D3
D2
D1
D0
C3
C2
C1
C0
E3
E2
E1
E0
0139/3320

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ISPLSI3320-70LQ Summary of contents

Page 1

... Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms Copyright © 2003 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. ...

Page 2

Functional Block Diagram Figure 1. ispLSI 3320 Functional Block Diagram Input Bus TOE Output Routing Pool (ORP I I/O 2 I/O 3 I I/O 6 I/O 7 I/O 8 ...

Page 3

Description (continued) All local logic block outputs are brought back into the GRP so they can be connected to the inputs of any other logic block on the device. The device also has 160 I/O cells, each of which is ...

Page 4

Absolute Maximum Ratings Supply Voltage V ................................................................................ -0.5 to +7.0V cc Input Voltage Applied ..................................................................... -2 Off-State Output Voltage Applied .................................................. -2 Storage Temperature ............................................................................. -65 to 150°C Case Temp. with Power Applied ........................................................... -55 to ...

Page 5

Switching Test Conditions Input Pulse Levels Input Rise and Fall Time Input Timing Reference Levels Output Timing Reference Levels Output Load 3-state levels are measured 0.5V from steady-state active level. Output Load conditions (See Figure 2) TEST CONDITION A 470Ω ...

Page 6

External Switching Characteristics 5 TEST 2 PARAMETER # COND Data Propagation Delay, 4PT Bypass, ORP Bypass pd1 Data Propagation Delay pd2 f max A 3 Clock Frequency with Internal Feedback f – 4 Clock ...

Page 7

Internal Timing Parameters 2 PARAMETER # Inputs t 24 I/O Register Bypass iobp t 25 I/O Latch Delay iolat t 26 I/O Register Setup Time before Clock iosu t 27 I/O Register Hold Time after Clock ioh t ioco 28 ...

Page 8

Internal Timing Parameters 2 PARAMETER # Outputs t 47 Output Buffer Delay Output Buffer Delay, Slew Limited Adder obs t 49 I/O Cell OE to Output Enabled oen t 50 I/O Cell OE to Output Disabled odis ...

Page 9

Timing Model I/O Cell I/O Reg Bypass I/O Pin #24 (Input) Input Register D Q RST #53 # Reset Y3,4 #52 Y0,1,2 GOE0,1 TOE Derivations of su, h and co from the Product ...

Page 10

Power Consumption Power consumption in the ispLSI 3320 device depends on two primary factors: the speed at which the device is operating and the number of product terms used. Figure 3. Typical Device Power Consumption vs fmax I CC can ...

Page 11

Signal Descriptions Signal Name GOE0, GOE1 Global Output Enable input pins. I/O Input/Output Pins – These are the general purpose I/O pins used by the logic array. TOE Test Output Enable pin – This pin tristates all I/O pins when ...

Page 12

Signal Locations Signal 208-Pin PQFP GOE0, GOE1 133, 134 TOE 30 RESET 28 Y0, Y1, Y2, Y3, Y4 132, 130, 129, 128, 127 BSCAN/ispEN 27 TDI/SDI 25 TCK/SCLK 24 TMS/MODE 23 TRST 29 TDO/SDO 185 GND 11, 26, 42, 53, ...

Page 13

I/O Locations Signal PQFP BGA Signal I C14 I A15 I B15 I C15 I D15 I A17 ...

Page 14

Pin Configuration ispLSI 3320 208-Pin PQFP (with Heat Spreader) Pinout Diagram 1 I/O 140 2 I/O 141 3 I/O 142 4 I/O 143 5 I/O 144 6 I/O 145 7 I/O 146 8 I/O 147 9 I/O 148 10 I/O ...

Page 15

Signal Configuration ispLSI 3320 320-Ball BGA Signal Diagram I/O I/O I/O I I/O I/O ...

Page 16

Part Number Description ispLSI 3320 Device Family Device Number Speed f 100 = 100 MHz max MHz max Ordering Information FAMILY fmax (MHz) tpd (ns) 100 100 ispLSI 70 70 Specifications ispLSI 3320 – – XXX ...

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