74LVTH16245 Fairchild Semiconductor, 74LVTH16245 Datasheet

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74LVTH16245

Manufacturer Part Number
74LVTH16245
Description
Manufacturer
Fairchild Semiconductor
Datasheet

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© 2001 Fairchild Semiconductor Corporation
74LVT16245GX
(Note 1)
74LVT16245MEA
(Note 2)
74LVT16245MTD
(Note 2)
74LVTH16245GX
(Note 1)
74LVTH16245MEA
(Note 2)
74LVTH16245MTD
(Note 2)
74LVT16245 • 74LVTH16245
Low Voltage 16-Bit Transceiver with 3-STATE Outputs
General Description
The LVT16245 and LVTH16245 contain sixteen non-invert-
ing bidirectional buffers with 3-STATE outputs and is
intended for bus oriented applications. The device is byte
controlled. Each byte has separate control inputs which
can be shorted together for full 16-bit operation. The T/R
inputs determine the direction of data flow through the
device. The OE inputs disable both the A and B ports by
placing them in a high impedance state.
The LVTH16245 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These
low-voltage (3.3V) V
to provide a TTL interface to a 5V environment. The
LVT16245 and LVTH16245 are fabricated with an
advanced BiCMOS technology to achieve high speed oper-
ation similar to 5V ABT while maintaining low power dissi-
pation.
Ordering Code:
Note 1: BGA package available in Tape and Reel only.
Note 2: Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
Order Number
non-inverting
CC
(Preliminary)
(Preliminary)
applications, but with the capability
transceivers
Package
Number
BGA54A
BGA54A
MS48A
MTD48
MS48A
MTD48
are
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[Tape and Reel]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[Tape and Reel]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300” Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
designed
DS500152
for
Features
Input and output interface capability to systems at
5V V
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16245),
also available without bushold feature (74LVT16245).
Live insertion/extraction permitted
Power Up/Down high impedance provides glitch-free
bus loading
Outputs source/sink 32 mA/ 64 mA
Functionally compatible with the 74 series 16245
Latch-up performance exceeds 500 mA
ESD performance:
Human-body model 2000V
Machine model 200V
Charged-device 1000V
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
CC
Package Description
January 1999
Revised August 2001
www.fairchildsemi.com

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74LVTH16245 Summary of contents

Page 1

... Features Input and output interface capability to systems Bushold data inputs eliminate the need for external pull-up resistors to hold unused inputs (74LVTH16245), also available without bushold feature (74LVT16245). Live insertion/extraction permitted Power Up/Down high impedance provides glitch-free bus loading Outputs source/sink 32 mA ...

Page 2

Connection Diagrams Pin Assignment for SSOP and TSSOP Pin Assignment for FBGA (Top Thru View) www.fairchildsemi.com Pin Descriptions Pin Names Description OE Output Enable Input (Active LOW) n T/R Transmit/Receive Input n A –A Side A Inputs/3-STATE Outputs 0 15 ...

Page 3

Functional Description The LVT16245 and LVTH16245 contain sixteen non-inverting bidirectional buffers with 3-STATE outputs. The device is byte controlled with each byte functioning identically, but independent of the other. The control pins can be shorted together to obtain full 16-bit ...

Page 4

Absolute Maximum Ratings Symbol Parameter V Supply Voltage Input Voltage I V Output Voltage Input Diode Current Output Diode Current Output Current Supply Current per ...

Page 5

... Increase in Power Supply Current CC (Note 8) Note 5: Applies to bushold versions only (74LVTH16245). Note 6: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 7: An external driver must sink at least the specified current to switch from HIGH-to-LOW. Note 8: This is the increase in supply current for each input that is at the specified voltage level rather than V ...

Page 6

Physical Dimensions inches (millimeters) unless otherwise noted 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide www.fairchildsemi.com Package Number BGA54A Preliminary 6 ...

Page 7

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300” Wide Package Number MS48A 7 www.fairchildsemi.com ...

Page 8

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves ...

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