MAX9737ETG+T Maxim Integrated Products, MAX9737ETG+T Datasheet - Page 10

• Manufacturer Part Number: MAX9737ETG+T
• Description: IC AMP AUDIO 13W MONO D 24TQFN
• Manufacturer: Maxim Integrated Products
• Type: Class Dr

Specifications of MAX9737ETG+T

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 13W x 1 @ 4 Ohm
• Voltage - Supply: 8 V ~ 28 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Shutdown
• Mounting Type: Surface Mount
• Package / Case: 24-TQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Mono 7W Class D Amplifier
Proper layout and grounding are essential for optimum
performance. Use wide traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance. Proper grounding improves
audio performance, minimizes crosstalk between chan-
nels, and prevents switching noise from coupling into
the audio signal. Connect PGND and AGND together at
a single point on the PCB. Route all traces that carry
switching transients away from AGND and the
traces/components in the audio signal path.
Bypass PVDD with two 1µF capacitors to PGND. Place
the bypass capacitors as close as possible to the
MAX9737. Place a 100µF capacitor between PVDD and
PGND. Bypass V
to AGND.
10
Supply Bypassing, Layout, and Grounding
______________________________________________________________________________________
S
, V
COM
20kΩ
0.47μF
R
C
IN
IN
, and V
C
1μF
1μF
LOGIC INPUT
COM
AUDIO
INPUT
20kΩ
R
SHDN
REG
FB
C
COM
with a 1µF capacitor
PRE
REG
REG
PC
IN
6
12
8
7
9
5
SHDN
PRECHARGE
REGULATOR
CONTROL
1μF
V
13, 14
S
BIAS
8V TO 28V
4
MUTE
1, 17, 18
PVDD
Use wide, low-resistance output traces. Current drawn
from the outputs increases as load impedance
decreases. High-output trace resistance decreases the
power delivered to the load. The MAX9737 TQFN pack-
age features an exposed thermal pad on its underside.
This pad lowers the package’s thermal resistance by
providing a heat conduction path from the die to the
PCB. Connect the exposed thermal pad to PGND by
using a large pad and multiple vias to the PGND plane.
V
S
1μF
3, 10, 11
1μF
AGND
C1P
Typical Application Circuit
16
MAX9737
POWER
100μF
CHARGE
STAGE
PUMP
0.1μF
21, 22
C1
PGND
C1N
15
23, 24
19, 20
2
CHOLD
OUT+
OUT-
C2
1μF