TD62783AFWG TOSHIBA Semiconductor CORPORATION, TD62783AFWG Datasheet

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TD62783AFWG

Manufacturer Part Number
TD62783AFWG
Description
8CH HIGH-VOLTAGE SOURCE DRIVER
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

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Part Number:
TD62783AFWG
Manufacturer:
TOS
Quantity:
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Part Number:
TD62783AFWG
Manufacturer:
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8CH HIGH−VOLTAGE SOURCE DRIVER
The TD62783APG / AFWG Series are comprised of eight source
current Transistor Array.
These drivers are specifically designed for fluorescent display
applications.
Applications include relay, hammer and lamp drivers.
The suffix (G) appended to the part number represents a Lead
(Pb)-Free product.
FEATURES
PIN CONNECTION
High output voltage: V
Output current (single output) I
Output clamp diodes
Single supply voltage
Input compatible with various types of logic
Package Type−APG
Package Type−AFWG : SOL−18 pin
TD62783APG / AFWG
TD62784APG / AFWG
TD62783APG,TD62783AFWG,TD62784APG,TD62784AFWG
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TYPE
: DIP−18 pin
(TOP VIEW)
CC
(Manufactured by Toshiba Malaysia)
TTL, 5 V CMOS
6~15 V PMOS, CMOS
= 50 V MIN.
DESIGNATION
OUT
= −500 mA MAX.
1
Note:
SCHEMATICS
The input and output parasitic diodes cannot
be used as clamp diodes.
Weight
DIP18−P−300−2.54F: 1.478 g (Typ.)
SOL18−P−300−1.27: 0.48 g (Typ.)
TD62783APG
TD62784APG
TD62783AFWG
TD62784AFWG
TD62783,784APG/AFWG
(EACH DRIVER)
2006-09-21

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TD62783AFWG Summary of contents

Page 1

... TD62784APG / AFWG 6~15 V PMOS, CMOS PIN CONNECTION (TOP VIEW) TD62783,784APG/AFWG TD62783APG TD62784APG = −500 mA MAX. TD62783AFWG TD62784AFWG Weight DIP18−P−300−2.54F: 1.478 g (Typ.) SOL18−P−300−1.27: 0.48 g (Typ.) SCHEMATICS Note: The input and output parasitic diodes cannot be used as clamp diodes. ...

Page 2

ABSOLUTE MAXIMUM RATINGS CHARACTERISTIC Supply Voltage Output Current Input Voltage Clamp Diode Reverse Voltage Clamp Diode Forward Current APG Power Dissipation AFWG Operating Temperature Storage Temperature Note 1: Only TD62783APG / AFWG Note 2: Only TD62784APG / AFWG Note 3: ...

Page 3

ELECTRICAL CHARACTERISTICS CHARACTERISTIC Output Leakage Current Output Saturation Voltage TD62783APG / AFWG Input Current TD62784APG / AFWG TD62783APG / AFWG TD62784APG / AFWG Input Voltage TD62783APG / AFWG TD62784APG / AFWG Supply Current Clamp Diode Reverse Current Clamp Diode Forward ...

Page 4

TEST CIRCUIT 1. I CEX (ON OFF Note 1: Pulse width 50 µs, duty cycle 10% ≤ 5 ns, t Output impedance 50 Ω ...

Page 5

TD62783,784APG/AFWG 5 2006-09-21 ...

Page 6

TD62783,784APG/AFWG 6 2006-09-21 ...

Page 7

PACKAGE DIMENSIONS Weight: 1.478 g (typ.) TD62783,784APG/AFWG 7 2006-09-21 ...

Page 8

PACKAGE DIMENSIONS Weight: 0.48 g (typ.) TD62783,784APG/AFWG 8 2006-09-21 ...

Page 9

Notes on Contents Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. ...

Page 10

Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...

Page 11

About solderability, following conditions were confirmed • Solderability (1) Use of Sn-37Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use ...

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