TD62592AP TOSHIBA Semiconductor CORPORATION, TD62592AP Datasheet
TD62592AP
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TD62592AP Summary of contents
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... TD62595AP, TD62595AF, TD62596AP, TD62596AF TD62597AP, TD62597AF, TD62598AP, TD62598AF Package type−AP : DIP−18pin Package type−AF : SOP−18pin PIN CONNECTION (TOP VIEW) TD62591AP, TD62592AP, TD62593AP, TD62594AP TD62591~594AP,595~598AP/AF Weight DIP18-P-300-2.54D: 1.47 g (typ.) SOP18-P-375-1.27: 0.5 g (typ.) TD62595AP, TD62595AF, TD62596AP, TD62596AF TD62597AP, TD62597AF, TD62598AP, TD62598AF 1 ...
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... Note 1: Except TD62591~TD62594AP Note 2: Except TD62591AP, TD62595AP, TD62595AF Note 3: Only TD62591AP, TD62595AP, TD62595AF Note 4: Delated above 25°C in the proportion of 11.7mW / °C (AP−Type), 7.7mW / °C (F, AF−Type) Note 5: SOP−18pin TD62591~594AP,595~598AP/AF TD62592AP, TD62593AP, TD62594AP TD62596AP, TD62596AF, TD62597AP, TD62597AF, TD62598AP, TD62598AF (Ta = 25°C) SYMBOL RATING ...
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RECOMMENDED OPERATING CONDITIONS CHARACTERISTIC Collector−Emitter Voltage Collector−Base Voltage Collector Current Clamp Diode Reverse Voltage Input Voltage Input Current TD62592 TD62596 Input Voltage TD62593 (Output On) TD62597 TD62594 TD62598 AP Power Dissipation AF ELECTRICAL CHARACTERISTICS CHARACTERISTIC Output Leakage Current Collector−Emitter Saturation ...
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... Output impedance 50 Ω, t ≤ Note 2: See below Input Condition TYPE NUMBER TD62591AP, TD62595AP, TD62595AF TD62592AP, TD62596AP, TD62596AF TD62593AP, TD62597AP, TD62597AF TD62594AP, TD62598AP, TD62598AF Note 3: C includes probe and jig capacitance L PRECAUTIONS for USING This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. ...
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TD62591~594AP,595~598AP/AF 5 2006-06-14 ...
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TD62591~594AP,595~598AP/AF 6 2006-06-14 ...
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PACKAGE DIMENSIONS DIP18−P−300−2.54D Weight: 1.47 g (typ.) TD62591~594AP,595~598AP/AF 7 Unit: mm 2006-06-14 ...
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PACKAGE DIMENSIONS SOP18−P−375−1.27 Weight: 0.50 g (typ.) TD62591~594AP,595~598AP/AF 8 Unit: mm 2006-06-14 ...
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Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the ...
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Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...
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RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to ...