TDA1308T/N2,112 NXP Semiconductors, TDA1308T/N2,112 Datasheet - Page 12

• Manufacturer Part Number: TDA1308T/N2,112
• Description: IC AMP AUDIO .08W STER AB 8SOIC
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of TDA1308T/N2,112

• Output Type: Headphones, 2-Channel (Stereo)
• Package / Case: 8-SOIC (3.9mm Width)
• Max Output Power X Channels @ Load: 80mW x 2 @ 32 Ohm
• Voltage - Supply: 3 V ~ 7 V, ±1.5 V ~ 3.5 V
• Features: Depop, Short-Circuit Protection
• Mounting Type: Surface Mount
• Product: Class-AB
• Available Set Gain: 70 dB
• Thd Plus Noise: 0.03 %
• Operating Supply Voltage: 5 V
• Supply Current: 3 mA
• Maximum Power Dissipation: 25 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 32 Ohms
• Dual Supply Voltage: +/- 2.5 V
• Input Bias Current (max): 10 pA
• Input Offset Voltage: 10 mV
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Single
• Supply Type: Single or Dual
• Supply Voltage (max): 7 V
• Supply Voltage (min): 3 V
• Dc: 0923
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-2090-5; 935273874112; TDA1308T/N2

NXP Semiconductors
TDA1308
Product data sheet
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 7.
Table 8.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
8
13.
Rev. 5 — 14 March 2011
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
Class-AB stereo headphone driver
13) than a SnPb process, thus
≥ 350
220
220
> 2000
260
245
245
TDA1308
© NXP B.V. 2011. All rights reserved.
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