NS32FX200VF-25 National Semiconductor, NS32FX200VF-25 Datasheet

no-image

NS32FX200VF-25

Manufacturer Part Number
NS32FX200VF-25
Description
IC MPU SERIES 132PQFP
Manufacturer
National Semiconductor
Datasheet

Specifications of NS32FX200VF-25

Function
Controller
Interface
MICROWIRE™, Serial, UART
Number Of Circuits
*
Voltage - Supply
5V
Operating Temperature
0°C ~ 70°C
Mounting Type
*
Package / Case
*
Includes
*
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*NS32FX200VF-25

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NS32FX200VF-25
Manufacturer:
NATIONAL
Quantity:
230
C 1995 National Semiconductor Corporation
NS32FX100-15 NS32FX100-20 NS32FV100-20
NS32FV100-25 NS32FX200-20 NS32FX200-25
System Controller
General Description
The NS32FX200 NS32FV100 and NS32FX100 are highly
integrated system chips designed for a FAX system based
on National Semiconductor’s embedded processors
NS32FX161 NS32FV16 or NS32FX164 The NS32FX100 is
the common core for all three system chips
NS32FV100 and NS32FX200 offer additional functions
Throughout this document references to the NS32FX100
also apply to both the NS32FV100 and the NS32FX200
Specific NS32FV100 or NS32FX200 features are explicitly
indicated
The NS32FX200 NS32FV100 and NS32FX100 feature an
interface to devices like stepper motors printers and scan-
ners a Sigma-Delta CODEC an elapsed-time counter a
DMA controller an interrupt controller and a UART
The NS32FX200 is optimized for high-end FAX applications
such as plain-paper FAX and multifunctional peripherals
The NS32FX100 is optimized for low-cost FAX applica-
tions The NS32FV100 is optimized for thermal paper FAX
machines with Digital Answering Machine support
Features
Y
Y
Y
Y
Y
TRI-STATE is a registered trademark of National Semiconductor Corporation
MICROWIRE
Direct interface to the NS32FX161 NS32FV16 and
NS32FX164 embedded processors
Supports a variety of Contact Image Sensor (CIS) and
Charge Coupled Device (CCD) scanners
Direct interface to a variety of Thermal Print Head
(TPH) printers Bitmap shifter and DMA channels facili-
tate the connection of other types of printers
Supports two stepper motors
Direct interface to ROM and SRAM The NS32FX200
and NS32FV100 in addition interface to DRAM
devices
TM
and WATCHDOG
TM
are trademarks of National Semiconductor Corporation
TL EE11331
FIGURE 1-1 A FAX Controller Block Diagram
The
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Programmable wait state generator
Demultiplexed address and data buses
Multiplexed DRAM address bus (NS32FX200 and
NS32FV100)
Supports 3V freeze mode by maintaining only elapsed
time counter
Control of power consumption by disabling inactive
modules and reducing the clock frequency
Operating frequency
On-Chip full duplex Sigma-Delta CODEC with
On-Chip Interrupt Control Unit with
On-Chip counters WATCHDOG
MICROWIRE
ports
On-Chip DMA controller (NS32FX200 four channels
NS32FX100 NS32FV100 three channels)
Up to 37 on-chip general purpose I O pins expandable
externally
Flexible allocation of I O and modules’ pins
132-pin JEDEC PQFP package
Normal mode 19 6608 MHz 24 576 MHz in steps
of 1 2288 MHz (NS32FX200)
Normal mode 19 6608 MHz 24 576 MHz in steps
of 1 2288 MHz (NS32FV100)
Normal mode 14 7456 MHz 19 6608 MHz in steps
of 1 2288 MHz (NS32FX100)
Power Save mode Normal mode frequency divided
by sixteen
Total harmonic distortion better than
Programmable hybrid balance filter
Programmable reception and transmission filters
Programmable gain control
16 interrupt sources
Programmable triggering mode
TM
System Clock Generator and I O
TL EE 11331 – 1
TM
PRELIMINARY
UART
RRD-B30M105 Printed in U S A
b
70 dB
July 1992

Related parts for NS32FX200VF-25

NS32FX200VF-25 Summary of contents

Page 1

... Supports two stepper motors Y Direct interface to ROM and SRAM The NS32FX200 Y and NS32FV100 in addition interface to DRAM devices FIGURE 1-1 A FAX Controller Block Diagram TRI-STATE is a registered trademark of National Semiconductor Corporation MICROWIRE TM and WATCHDOG TM are trademarks of National Semiconductor Corporation C 1995 National Semiconductor Corporation ...

Page 2

FAX SYSTEM CONFIGURATION 1 1 Block Diagram Description 1 2 Module Diagram Bus and Memory Controller (BMC Timing Control Unit (TCU Sigma-Delta CODEC (SDC Scanner Controller ...

Page 3

Table of Contents 2 0 ARCHITECTURE (Continued Bus and Memory Controller (BMC Features Operation Zones 0 1 (ROM and SRAM) Transactions Zone 2 (Dynamic ...

Page 4

FIGURE 1-1 A FAX Controller Block Diagram FIGURE 1-2 NS32FX100 Module Diagram FIGURE 1-3 NS32FV100 Module Diagram FIGURE 1-4 NS32FX200 Module Diagram FIGURE 1-5 System Chip States and Operation Modes FIGURE 2-1 Clocks and Traps Connectivity FIGURE 2-2 High Speed ...

Page 5

FIGURE 4-1 Connection Diagram Top View FIGURE 4-2 Analog Circuitry Block Diagram FIGURE 4-3 TTL Output Signals Specification Standard FIGURE 4-4 TTL Input Signals Specification Standard FIGURE 4-5 CMOS Output Signals Specification Standard FIGURE 4-6 CMOS Input Signals Specification Standard ...

Page 6

Fax-System Configuration A typical FAX system based on the NS32FX100 NS32FX200 or NS32FV100 is shown in Figure 1 BLOCK DIAGRAM DESCRIPTION CPU The typical FAX system shown below is based on a single embedded processor The ...

Page 7

Fax-System Configuration 1 2 MODULE DIAGRAM The various functions of the NS32FX100 NS32FV100 and NS32FX200 are performed by on-chip modules as shown below The NS32FX100 module diagram is shown in Figure 1-2 FIGURE 1-2 NS32FX100 Module Diagram The ...

Page 8

Fax-System Configuration The NS32FX100 modules and their functions are summa- rized below For a more detailed description of each mod- ule see the relevant section Bus and Memory Controller (BMC) The Bus and Memory Controller ...

Page 9

Fax-System Configuration power-fail input is asynchronous It is recognized by the NS32FX100 during cycles in which the input setup-time re- quirement is satisfied Switching from Normal mode to Power Save mode and vice versa must always be carried ...

Page 10

Architecture 2 1 MCFG MODULE CONFIGURATION REGISTER The software can configure some of the NS32FX100 major operation modes by programming the Module Configuration Register (MCFG) Some of the bits in this register are also used to initialize the ...

Page 11

Architecture (Continued External Clocks The TCU contains two oscillators the high-speed oscillator and the low-speed oscillator The high-speed oscillator is the FAX system clocking source It generates the CPU clock and after division clocks ...

Page 12

Architecture (Continued Registers CSCL CCLK (CPU Input Clock) Scale register res F F Controls the CCLK frequency 1 The CCLK frequency is the FOSCI input frequency divided The ...

Page 13

... NSFAX Software package fully supports the SDC Software drivers handle both the SDC initialization and data transfers National Semiconductor’s modem software is usually pro- vided in binary form and hence the internal structure of the SDC is transparent to the user A detailed description of the ...

Page 14

Architecture (Continued) FIGURE 2-4 Sigma-Delta Block Diagram 11331 – 9 ...

Page 15

Architecture (Continued) A full Sigma-Delta CODEC includes a digital part and an analog part The NS32FX100 includes the digital part and the analog part should be implemented externally On-Chip Digital Blocks Sigma-Delta Over Sampling ...

Page 16

Architecture (Continued) 16 ...

Page 17

Architecture (Continued Analog Transmitter The input to the transmit analog circuit is the serial bit stream at OSR which is generated by DSDM This serial bit stream is fed to a 1-bit D A ...

Page 18

Architecture (Continued) SDTGC Transmit Gain Control register Used to attenuate the transmit IIR input samples The value to be written in SDTGC register is 16384 rounded to the nearest integer number Some examples are given in the following ...

Page 19

Architecture (Continued Scanner Signals Generator Block This block generates the timing control signals required by CIS and CCD scanners Scanners with line scan time ...

Page 20

Architecture (Continued Scanner Period Pulse (SPP) Generation The Scanner Period Pulse (SPP) is used to synchronize all the scanner control signals It is derived from the time slots generated by the TCU module (which ...

Page 21

Architecture (Continued) SLS Pulse Generation Scan Line Sync (SLS) is generated by a timer according to a calculated delay (in CTTL cycles) from the beginning of the SPP pulse The delay between the beginning of SPP and the ...

Page 22

Architecture (Continued) Video DAC (Shading-Compensation) The shading-compensation circuit includes an 8-bit multiply- ing Digital-to-Analog Converter (DAC) that multiplies SVI the analog input from an external video sample and hold circuit with a digital reference value (white line) fetched ...

Page 23

Architecture (Continued) Pixel Generator Pixels may be treated in one of three ways No bypass The output of the video comparator is an image pixel It may be inverted by the pixel generator before the pixel is shifted ...

Page 24

Architecture (Continued res LSPP PDWP DISP Scanner Discharge Pulse Polarity 0 Active low 1 Active high SNHP Sample and Hold Pulse Polarity 0 Active low 1 Active high PDWP Peak Detector Window Polarity 0 ...

Page 25

Architecture (Continued) 8 The peak detector window may be used to disable the ABC circuit outside the programmed window The ac- tive video window and the peak detector window are configured separately thus allowing a peak detector window ...

Page 26

Architecture (Continued) Strobes Generator A train of strobes consists of two or four strobes depending on the strobes mode The train of strobe pulses starts on the time slot pre-defined in the Printer Strobes-Start Time Slot (PSTSL) register ...

Page 27

Architecture (Continued) Printer Interrupt Generator The Interrupt Control Unit dedicates one interrupt either to the Strobes-Done pulse or to DMA channel 1 The Printer Interrupt Source (PIS) bit of the TPHC register selects which of the interrupt pulses ...

Page 28

Architecture (Continued Registers PBCFG Printer Bitmap Shifter Configuration register 7 2 res ECLK External Clock (NS32FX200 only ) 0 Shift using an internal clock Clock frequency is selected by the printer bitmap internal clock generator ...

Page 29

Architecture (Continued) b Initialize the PRNTC module to work with an external clock c Initialize DMA channel 1 registers without enabling the channel (set CNTL1 CHEN Set MCFG ECOUNT and MCFG EPBMS to ‘‘1’’ to ...

Page 30

Architecture (Continued) Memory-to-I O Operation The data is first read from the source into the DMA Control- ler and is subsequently written to the destination When the DIR bit is ‘‘0’’ the first bus-cycle is used to read ...

Page 31

Architecture (Continued) DEC Decrement Increment update of ADCA 0 ADCA incremented after each transfer cycle (if ADA ADCA decremented after each transfer cycle (if ADA 1) e NFBY Fly-By Memory-to-I O Transfers for channel 3 ...

Page 32

Architecture (Continued) (3) The OVR bit in the STAT register is set to ‘‘1’’ and the EOVR bit is ‘‘1’’ In the last case the CHEN bit is forced to ‘‘0’’ and cannot be set to ‘‘1’’ by ...

Page 33

Architecture (Continued) FIGURE 2-16 DMA Fly-By Write Transaction (DIR The maximum throughput of a DMA channel Mbyte sec (Two bytes can be transferred at a rate of four CTTL cycles per transfer ...

Page 34

Architecture (Continued) FIGURE 2-17 DMA Memory (Indirect) Read Transaction (DIR The maximum throughput of a DMA channel is 3 125 Mbyte sec (One byte can be transferred at a rate of eight CTTL cycles per ...

Page 35

Architecture (Continued) FIGURE 2-18 DMA Memory Write Transaction (DIR The maximum throughput of a DMA channel is 3 125 Mbyte sec (One byte can be transferred at a rate of eight CTTL cycles per transfer ...

Page 36

Architecture (Continued) FIGURE 2-19 Two Adjacent Fly-By DMA Transactions The maximum throughput of a DMA channel Mbyte sec (Two bytes can be transferred at a rate of four CTTL cycles per transfer ...

Page 37

Architecture (Continued) A transmit interrupt is generated on transmit ready if not masked by the UMASK register A receive interrupt is gener- ated if not masked by the UMASK register on receive ready for every received character regardless ...

Page 38

Architecture (Continued TBRK res res res TSB EDB EPS Even Parity Select 0 Odd parity 1 Even parity Even parity means that the total number of bits set (including the parity bit) ...

Page 39

Architecture (Continued) Accessing MWSIO while the MWIRE is busy (MWCSR BUSY 1) may cause unpredictable e results MWCSR MICROWIRE Control and Status register res CLKM CDV BUSY Read only Set to ‘‘1’’ during MWIRE ...

Page 40

Architecture (Continued Usage Recommendations 1 Before activating the MICROWIRE program the appro- priate Ports module registers PBDO PBMS PCDO PCMS and PCEN to connect the MICROWIRE module to the NS32FX100 I O pins 2 The ...

Page 41

Architecture (Continued Registers IVCT Interrupt Vector register Read only 8-bit regis- ter INTVECT INTVECT When INTR pin is active this field contains the encoded value of ...

Page 42

Architecture (Continued) with other modules and are allocated by software Input pins can always be read even if shared with another mod- ule Output pins can be enabled or disabled (TRI-STATE) The characteristics of the four bits which ...

Page 43

Architecture (Continued) Four bits are associated with each general purpose I O pin of this port DI Data In Bit DO Data Out Bit EN Enable Bit MS Module Select Bit Port input data is asynchronous When the ...

Page 44

Architecture (Continued) PCDI Port C data in Read only Holds the current value of the pins (latched once each CTTL SBPYS PCLK SNH UREN UTXD MWSO DMRQ2 DMRQ1 DMRQ0 PCDO Port C ...

Page 45

Architecture (Continued) PCEN Port C Enable EN7 EN6 EN5 EN4 EN3 EN2 EN0–EN7 Enable bit for Port C output pins A pin is driven when its relevant ENi bit is set to ...

Page 46

Architecture (Continued) Memory transactions are either adjacent (back-to-back) or spaced with idle cycles To increase pre-charge time and to avoid contention on the AD0–AD15 bus the memory trans- actions may be spaced by idle cycles When an IDLEi ...

Page 47

Architecture (Continued other memory transactions address bits A12–A15 are driven onto MA12–MA15 in T1 (non-multiplexed) CAS is asserted low in T3 Once CAS is asserted the transaction may be extended by wait states denoted by T3W ...

Page 48

Architecture (Continued) IDLE1 Zone 1 SRAM idle control See IDLEi below WAIT2 Zone 2 DRAM wait state control See WAITi below IDLE2 Zone 2 DRAM idle control See IDLEi below WAITi Number of T3W (wait) extension cycles (i ...

Page 49

Architecture (Continued) l ETC rw FE0500 31 ETC l RFEN rw FE0505 NS32FX200 and only res EN res l RFRT rw FE0506 NS32FX200 and only 7 RFRT SDC l SDCNTL rw FE01E0 ...

Page 50

Architecture (Continued) l SCMPRW w FE0220 7 SCMPRW l SPRES w FE0222 7 SPRES l SVHC rw FE0240 res BYPASS INVERT VDILS l SVDB rw FE0242 15 SVDB l SBMS r FE0244 15 SBMS ...

Page 51

Architecture (Continued) l CNTL0 FFF03E l CNTL1 FFF05E l CNTL2 FFF07E l CNTL3 FFF09E NS32FX200 only 7 2 res UART l UCNTL rw FE0601 TBRK res res res TSB EDB l UMASK ...

Page 52

Architecture (Continued) PORTS l PBDO rw FE0812 SDIS SCLK2 DMAK3 DMAK1 STB3 STB2 DMAK2 DMAK0 res SLS SCLK1 l PBMS rw FE0814 ...

Page 53

System Interface 3 1 POWER AND GROUNDING The NS32FX100 requires a 5V 10% supply to nine digital g pins and supply to two analog pins Two pins g provide analog ground nine pins provide digital ...

Page 54

System Interface (Continued BUS CYCLES Memory transactions issued by the CPU and the NS32FX100 are almost identical The transactions differ as follows 1 During the CPU transactions data is driven onto AD0–15 throughout T4 whereas on ...

Page 55

System Interface (Continued) FIGURE 3-5 Zones 0 1 (ROM SRAM) Write Transaction Zero Wait State FIGURE 3-6 Zones 0 1 (ROM SRAM) Write Transaction One Wait State 11331 – 11331– 38 ...

Page 56

System Interface (Continued) FIGURE 3-7 Zone 2 (DRAM) Refresh Transaction Zero Wait State If a new CPU DMA transaction to either Zone started during the refresh transaction it is postponed by CWAIT until ...

Page 57

System Interface (Continued) FIGURE 3-10 Zone 2 (DRAM) Read Transaction Zero Wait State ( ) Note OE or WEi according to other Zone 0 or Zone 1 access figures FIGURE 3-11 Zones 0 1 Access Delayed by a ...

Page 58

System Interface (Continued) FIGURE 3-12 Zone 2 (DRAM) Read Transaction One Wait State FIGURE 3-13 Zone 2 (DRAM) Write Transaction Zero Wait State 11331 – 11331– 45 ...

Page 59

System Interface (Continued) FIGURE 3-14 Zone 2 (DRAM) Write Transaction One Wait State FIGURE 3-15 Zone Read Transaction Two Wait States 11331– 11331– 47 ...

Page 60

System Interface (Continued) FIGURE 3-16 Zone Read Transaction Four Wait States FIGURE 3-17 Zone Write Transaction Four Wait States 11331 – 11331 – 49 ...

Page 61

System Interface (Continued) FIGURE 3-18 Zone Write Transaction Six Wait States FIGURE 3-20 Spaced Memory Transaction Two Tidles after T4 FIGURE 3-19 CPU DMA Arbitration 11331– 11331 – 51 ...

Page 62

Device Specifications 4 1 NS32FX100 PIN DESCRIPTIONS The following is a brief description of all NS32FX100 pins Some NS32FX100 pins have flexible allocation These pins can be individually configured as general purpose pins even Supplies ...

Page 63

Device Specifications Output Signals Signal Pin Numbers BUZCLK 59 Buzzer Clock Programmable frequency clock for the buzzer CAS 104 DRAM Column Address Strobe Column address strobe for DRAM banks refresh (NS32FX200 and NS32FV100 ) CCLK ...

Page 64

Device Specifications Output Signals (Continued) Signal Pin Numbers SDIS DMAK2 27 SDOUT 20 SEL0 108 SEL1 110 SEL3 107 SLS 21 SMPH0 – SOSCO 63 SPDW 23 STB0 – ...

Page 65

Device Specifications (Continued OUTPUT SIGNAL LEVELS The following tables show the levels of the NS32FX100 output control signals during reset or power save mode Freeze Mode Output Signals Output signals are driven during ...

Page 66

Device Specifications (Continued) 132-Pin PQFP Package Top View FIGURE 4-1 Connection Diagram 11331 – 54 ...

Page 67

... Device Specifications (Continued ABSOLUTE MAXIMUM RATINGS If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Temperature under Bias Storage Temperature ELECTRICAL CHARACTERISTICS 10% GND CCD g Symbol Parameter V High Level Input Voltage IH V Low Level Input Voltage ...

Page 68

Device Specifications (Continued ELECTRICAL CHARACTERISTICS 10% GND CCD Symbol Parameter I Leakage Current Output L and I O Pins in TRI-STATE or Input ...

Page 69

Device Specifications (Continued ANALOG ELECTRICAL CHARACTERISTICS CCA g GND Video MDAC Resolution Monotonicity Nonlinearity REF I Range OFF ...

Page 70

Device Specifications (Continued SWITCHING CHARACTERISTICS Definitions All the timing specifications given in this section refer the rising or falling edges of all the signals as illustrated ...

Page 71

Device Specifications Timing Tables Output Signals Internal Propagation Delays Symbol Figure Description t 4-8 CCLK Clock Period CLKp t 4-8 CCLK High Time CLKh t 4-8 CCLK Low Time CLKl t ...

Page 72

Device Specifications Timing Tables (Continued Output Signals Internal Propagation Delays (Continued) Reference Symbol Figure Description t 4-16 A16–23 Valid After R E AHv CTTL T1 t 4-16 A16–23 Hold After R ...

Page 73

Device Specifications Timing Tables (Continued Output Signals Internal Propagation Delays (Continued) Symbol Figure Description t 4-15 RAS0–1 Signal Active RASBBa (Freeze Mode) t 4-15 RAS0–1 Signal Active RASBBia (Freeze Mode) t ...

Page 74

Device Specifications Timing Tables (Continued Output Signals Internal Propagation Delays (Continued) Symbol Figure Description t 4-23 SMPH0–3 Signal SMPHa Active t 4-23 SMPH0–3 Signal SMPHia Inactive t 4-21 STB0–3 Signal STBa ...

Page 75

Device Specifications Timing Tables (Continued Output Signals Internal Propagation Delays (Continued) Symbol Figure Description t 4-24 UTXD Signal UTXDa Active t 4-24 UTXD Signal UTXDia Inactive t 4-24 UREN Signal URENa ...

Page 76

Device Specifications Timing Tables (Continued Input Signal Requirements Symbol Figure Description t 4-8 CTTL Clock R E CTTL to CTp Period Next R E CTTL t 4-8 CTTL High At 2 ...

Page 77

Device Specifications Timing Tables (Continued Input Signal Requirements (Continued) Reference Symbol Figure Description Condition t 4-9 ADS Signal Before R E ADSs Setup CTTL T2 t 4-9 ADS Pulse At 0 ...

Page 78

Device Specifications Timing Tables (Continued Input Signal Requirements (Continued) Reference Symbol Figure Description Condition t 4-24 URXD Signal Before R E URXDs Setup CTTL t 4-24 URXD Signal After R E ...

Page 79

Device Specifications (Continued) FIGURE 4-8 Clock Waveforms FIGURE 4-9 DRAM Read Bus Cycle 11331 – 11331– 62 ...

Page 80

Device Specifications (Continued) FIGURE 4-10 DRAM Write Bus Cycle 11331 – 63 ...

Page 81

Device Specifications (Continued) FIGURE 4-11 ROM SRAM Read Bus Cycle 11331– 64 ...

Page 82

Device Specifications (Continued) FIGURE 4-12 ROM SRAM Write Bus Cycle (One Wait State 11331 – 65 ...

Page 83

Device Specifications (Continued) FIGURE 4- Read Bus Cycle FIGURE 4- Write Bus Cycle 11331– 11331– 67 ...

Page 84

Device Specifications (Continued) FIGURE 4-15 DRAM Refresh Bus Cycles 11331 – 11331 – 69 ...

Page 85

Device Specifications (Continued) FIGURE 4-16 DMA Read Transaction (DIR Note t and t are irrelevant in Fly-By mode when the implied external i e when the DMA channel is used as an external channel Ds ...

Page 86

Device Specifications (Continued) Note CPU drives ADS A16–23 DDIN when HLDA becomes inactive FIGURE 4-17 DMA Write Transaction (DIR Note t t and t irrelevant in Fly-By mode when the implied external i e when ...

Page 87

Device Specifications (Continued) FIGURE 4-18 Interrupt Signals Timing FIGURE 4-19 Sigma-Delta Signals Timing FIGURE 4-20 SBYPS Input Signal Timing TL EE 11331 – 11331– 11331– 73 ...

Page 88

Device Specifications (Continued) FIGURE 4-21 Printer Signals Timing FIGURE 4-22 Reset Signals Timing 11331 – 11331 – 76 ...

Page 89

Device Specifications (Continued) Note For convenience all the above signals are shown on the same diagram The diagram shows the relationship between each signal and CTTL only There is no significance in the relationships between individual signals See ...

Page 90

Device Specifications (Continued) FIGURE 4-24 UART Signals Timing FIGURE 4-25 Mwire Signals Timing 11331– 11331 – 79 ...

Page 91

Device Specifications (Continued) FIGURE 4-26 Ports Signals Timing FIGURE 4-27 Analog Signals Timing 11331– 11331– 81 ...

Page 92

Appendix A Codec Transmission Performance The Sigma Delta Codec transmission performance of a typi- cal complete system including DAA is according to the fol- lowing test conditions The measurement analog circuit is according to Figure 2-5 The measurements are performed ...

Page 93

Appendix A Codec Transmission Performance TABLE A-2 Receiver Performance Parameter Receive Gain Absolute Accuracy Receive Gain Variation with Frequency Receive Noise Psofometric Weighted Signal to Total Distortion Total Gain Half Channel Sine Method Input Level (without transformer distortion) Signal to ...

Page 94

... Physical Dimensions inches (millimeters) Order Number NS32FX200VF NS32FX100VF or NS32FV100FV LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or ...

Related keywords