MAX4410EUD Maxim Integrated Products, MAX4410EUD Datasheet - Page 2

• Manufacturer Part Number: MAX4410EUD
• Description: Audio Amplifiers
• Manufacturer: Maxim Integrated Products

Specifications of MAX4410EUD

• Product: Audio Line Drivers / Receivers
• Output Power: 80 mW
• Thd Plus Noise: 0.00%
• Supply Current: 7 mA
• Maximum Power Dissipation: 727 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSSOP-14
• Audio Load Resistance: 16 Ohms
• Input Offset Voltage: 0.5 mV
• Minimum Operating Temperature: - 40 C
• Lead Free Status / Rohs Status: No

ABSOLUTE MAXIMUM RATINGS
PGND to SGND .....................................................-0.3V to +0.3V
PV
PV
PV
PV
IN_ to SGND ..........................................................-0.3V to +0.3V
SHDN_ to SGND........................(SGND - 0.3V) to (SV
OUT_ to SGND ............................(SV
C1P to PGND.............................(PGND - 0.3V) to (PV
C1N to PGND .............................(PV
Output Short Circuit to GND or V
80mW, DirectDrive Stereo Headphone Driver
with Shutdown
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(PV
unless otherwise noted. Typical values are at T
2
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
Supply Voltage Range
Quiescent Supply Current
Shutdown Supply Current
SHDN_ Thresholds
SHDN_ Input Leakage Current
SHDN_ to Full Operation
CHARGE PUMP
Oscillator Frequency
AMPLIFIERS
Input Offset Voltage
Input Bias Current
Power-Supply Rejection Ratio
Output Power
DD
SS
DD
SS
DD
_______________________________________________________________________________________
to SV
and SV
to SV
and SV
= SV
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
SS
PARAMETER
DD .................................................................
DD
SS
DD
.........................................................-0.3V to +0.3V
= 3V, PGND = SGND = 0, SHDNL = SHDNR = SV
to PGND or SGND ..........................-4V to +0.3V
to PGND or SGND .........................-0.3V to +4V
DD
...........................Continuous
SS
SS
SYMBOL
- 0.3V) to (PGND + 0.3V)
I
- 0.3V) to (SV
PSRR
P
I
t
f
SHDN
V
V
BIAS
I
SON
OSC
OUT
DD
DD
OS
A
= +25°C.) (Note 2)
-0.3V to +0.3V
Guaranteed by PSRR test
One channel enabled
Two channels enabled
SHDNL = SHDNR = GND
V
V
Input AC-coupled, R
1.8V ≤ V
200mV
THD + N = 1%
IH
IL
DD
DD
DD
+ 0.3V)
+ 0.3V)
+ 0.3V)
P-P
DD
ripple
≤ 3.6V
CONDITIONS
DD
, C1 = C2 = 2.2µF, R
Continuous Power Dissipation (T
Junction Temperature ......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature (soldering) (Note 1)
Lead Temperature (soldering, 10s) .................................+300°C
L
14-Pin TSSOP (derate 9.1mW/°C above +70°C) ..........727mW
16-Bump UCSP (derate 15.2mW/°C above +70°C)....1212mW
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
= 32Ω
DC
f
f
R
R
RIPPLE
RIPPLE
L
L
= 32Ω
= 16Ω
= 1kHz
= 20kHz
IN
= R
F
SV
= 10kΩ, R
0.7 x
-100
MIN
272
1.8
75
40
-1
DD
A
= +70°C)
TYP
175
320
L
0.5
90
90
55
65
80
4
7
6
= ∞, T
A
SV
MAX
+100
0.3 x
11.5
368
3.6
2.4
= T
10
+1
DD
MIN
to T
UNITS
kHz
mW
mA
mV
dB
µA
µA
nA
µs
V
V
MAX
,