BGA2022T NXP Semiconductors, BGA2022T Datasheet - Page 6

BGA2022T

Manufacturer Part Number
BGA2022T
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BGA2022T

Lead Free Status / Rohs Status
Compliant
Philips Semiconductors
PACKAGE OUTLINE
2000 Dec 04
Plastic surface mounted package; 6 leads
MMIC mixer
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE
VERSION
SOT363
1.1
0.8
A
max
0.1
A 1
6
1
0.30
0.20
b p
y
IEC
pin 1
index
e 1
0.25
0.10
c
D
e
2
5
2.2
1.8
b p
D
JEDEC
1.35
1.15
E
4
3
REFERENCES
0
1.3
e
w
B
M
B
0.65
e
1
SC-88
scale
EIAJ
6
1
H E
2.2
2.0
A
0.45
0.15
L p
A 1
2 mm
0.25
0.15
Q
H E
E
0.2
v
detail X
PROJECTION
0.2
EUROPEAN
w
L p
Q
0.1
A
y
c
Product specification
BGA2022
X
v
ISSUE DATE
M
97-02-28
A
SOT363

Related parts for BGA2022T