LT5537EDDB#PBF Linear Technology, LT5537EDDB#PBF Datasheet - Page 15

• Manufacturer Part Number: LT5537EDDB#PBF
• Manufacturer: Linear Technology

Specifications of LT5537EDDB#PBF

• Pin Count: 8
• Screening Level: Industrial
• Package Type: DFN
• Lead Free Status / Rohs Status: Compliant

PACKAGE DESCRIPTIO
2.50 ±0.05
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.15 ±0.05
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
0.25 ± 0.05
0.61 ±0.05
(2 SIDES)
2.20 ±0.05
(2 SIDES)
0.50 BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.675 ±0.05
PACKAGE
OUTLINE
U
(SEE NOTE 6)
8-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1702)
TOP MARK
PIN 1 BAR
0.200 REF
DDB Package
3.00 ±0.10
(2 SIDES)
2.00 ±0.10
0.75 ±0.05
(2 SIDES)
0 – 0.05
0.56 ± 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.15 ±0.05
(2 SIDES)
8
1
0.50 BSC
LT5537
0.38 ± 0.10
PIN 1
CHAMFER OF
EXPOSED PAD
15
(DDB8) DFN 1103
5537fa