PCF8574TS NXP Semiconductors, PCF8574TS Datasheet - Page 18

no-image

PCF8574TS

Manufacturer Part Number
PCF8574TS
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCF8574TS

Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Package Type
SSOP
Rad Hardened
No
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PCF8574TS
Manufacturer:
PHIL
Quantity:
6 500
Part Number:
PCF8574TS
Manufacturer:
NXP
Quantity:
221
Part Number:
PCF8574TS
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
PCF8574TS/3
Manufacturer:
PHILIPS-Pb free
Quantity:
1 775
Part Number:
PCF8574TS/3
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
PCF8574TS/3+118
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
PCF8574TS/3118
0
Part Number:
PCF8574TS/3Ј¬118
Manufacturer:
NXP
Quantity:
5 000
Part Number:
PCF8574TS/F3
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Philips Semiconductors
2002 Nov 22
SO16: plastic small outline package; 16 leads; body width 7.5 mm
Remote 8-bit I/O expander for I
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT162-1
max.
2.65
0.10
A
16
0.012
0.004
0.30
0.10
1
A
Z
1
y
pin 1 index
0.096
0.089
2.45
2.25
A
2
075E03
IEC
e
0.01
0.25
A
3
D
0.019
0.014
0.49
0.36
b
p
0.013
0.009
0.32
0.23
MS-013
JEDEC
b
c
p
0
REFERENCES
0.41
0.40
10.5
10.1
D
9
8
(1)
w
2
M
C-bus
0.30
0.29
E
7.6
7.4
(1)
scale
0.050
EIAJ
1.27
18
c
5
e
0.419
0.394
10.65
10.00
A
H
2
E
A
1
0.055
1.4
L
10 mm
0.043
0.016
1.1
0.4
L
H
E
p
E
detail X
0.043
0.039
1.1
1.0
Q
L
L
p
Q
PROJECTION
EUROPEAN
0.25
0.01
(A )
v
3
A
0.25
0.01
w
A
Product specification
X
0.004
v
0.1
y
M
PCF8574
ISSUE DATE
A
99-12-27
97-05-22
0.035
0.016
Z
0.9
0.4
(1)
SOT162-1
8
0
o
o

Related parts for PCF8574TS