PC451T Sharp Electronics, PC451T Datasheet

PC451T

Manufacturer Part Number
PC451T
Description
Manufacturer
Sharp Electronics
Datasheet

Specifications of PC451T

Input Type
DC
Output Type
DC
Output Device
Transistor
Number Of Elements
1
Reverse Breakdown Voltage
6V
Forward Voltage
1.4V
Forward Current
50mA
Collector-emitter Voltage
350V
Package Type
Mini Flat
Collector Current (dc) (max)
50mA
Isolation Voltage
3750Vrms
Power Dissipation
170mW
Collector-emitter Saturation Voltage
0.3V
Fall Time
12000ns
Rise Time
10000ns
Pin Count
4
Mounting
Surface Mount
Operating Temp Range
-25C to 100C
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
■ Description
■ Features
PC451 Series
a phototransistor.
1. 4-pin Mini-flat package
2. Double transfer mold package (Ideal for Flow Solder-
3. High collector-emitter voltage (V
4. High isolation voltage between input and output
Notice The content of data sheet is subject to change without prior notice.
PC451 Series contains an IRED optically coupled to
It is packaged in a 4-pin Mini-flat.
Input-output isolation voltage(rms) is 3.75kV.
Collector-emitter voltage is 350V.
CTR is MIN. 40% at input current of 5mA.
ing)
(V
iso(rms)
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
: 3.75kV)
CEO
: 350V)
1
■ Agency approvals/Compliance
■ Applications
Mini-flat Package,
High Collector-emitter Voltage
Photocoupler
1. Recognized by UL1577 (Double protection isolation),
2. Package resin : UL flammability grade (94V-0)
1. Telephones
2. Modems
file No. E64380 (as model No. PC451)
Sheet No.: D2-A00301EN
PC451 Series
© SHARP Corporation
Date Sep. 30. 2003

Related parts for PC451T

PC451T Summary of contents

Page 1

PC451 Series ■ Description PC451 Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin Mini-flat. Input-output isolation voltage(rms) is 3.75kV. Collector-emitter voltage is 350V. CTR is MIN. 40% at input current of 5mA. ■ ...

Page 2

Internal Connection Diagram 1 2 ■ Outline Dimensions ±0.3 3.6 ±0.25 2. Date code SHARP mark "s" Anode mark ±0 0.4 Epoxy resin Anode 1 4 Cathode 2 Emitter 3 3 Collector ...

Page 3

Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...

Page 4

Absolute Maximum Ratings Parameter Symbol Forward current I F Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C Total power dissipation P tot Operating ...

Page 5

... Model Line-up Taping Package 3 000 pcs/reel 750 pcs/reel Model No. PC451 PC451T Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. 5 PC451 Series Sheet No.: D2-A00301EN ...

Page 6

Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 200 150 100 50 0 − Ambient temperature T ...

Page 7

Fig.7 Current Transfer Ratio vs. Forward Current 100 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 50 0 − Ambient temperature T Fig.11 Collector Dark ...

Page 8

Fig.13 Test Circuit for Response Time Input Output Output Input Please refer to the conditions in Fig.12 Fig.15 Test Circuit for Frequency Response R D Please refer to ...

Page 9

Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...

Page 10

Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...

Page 11

Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...

Page 12

Package specification ● Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 ...

Page 13

Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A B ±0.3 ±0.1 12.0 5 ...

Page 14

Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...

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