TD62783AF Toshiba, TD62783AF Datasheet

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... Input compatible with various types of logic • Package type-AP: DIP-18 pin • Package type-AF: SOP-18 pin Type TD62783AP/AF TD62784AP/AF Pin Assignment (top view TD62783AP TD62784AP = −500 mA (min) TD62783AF TD62784AF Designation TTL, 5V CMOS 6 to 15V PMOS, CMOS Weight DIP18-P-300-2.54D: 1.47 g (typ.) SOP18-P-375-1.27: 0.41 g (typ GND TD62783,784AP/AF 2006-06-14 ...

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Schematics (each driver) 10 kΩ Input TD62783 TD62784 Note: The input and output parasitic diodes cannot be used as clamp diodes. Absolute Maximum Ratings Characteristics Supply voltage Output current Input voltage Clamp diode ...

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Recommended Operating Conditions Characteristics Supply voltage Output current AF TD62783AP/AF Input voltage TD62784AP/AF TD62783AP/AF Output ON TD62784AP/AF Input voltage TD62783AP/AF Output OFF TD62784AP/AF AP Clamp diode reverse voltage AF Clamp diode forward current AP Power dissipation AF (Ta = 25°C) ...

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Test Circuit 1. I CEX CEX (ON) IN (OFF (ON) IN (OFF) I OUT OFF V Input ...

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I – V OUT IN 500 TA62783AP/ 25°C typ. 400 300 200 100 0 0 0.4 0.8 1.2 1.6 Input voltage V ( – 1.6 TA62783AP/ 25°C typ. 1.2 0.8 0.4 ...

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P – 2.0 (1) Type-AP free air (2) Type-AF free air 1.5 (1) 1.0 (2) 0 500 100 150 Ambient temperature Ta (°C) 200 6 TD62783,784AP/AF 2006-06-14 ...

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Package Dimensions Weight: 1.47 g (typ.) TD62783,784AP/AF 7 2006-06-14 ...

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Package Dimensions Weight: 0.41 g (typ.) TD62783,784AP/AF 8 2006-06-14 ...

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Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the ...

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Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...

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... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property ...