74AHC1G08GW NXP Semiconductors, 74AHC1G08GW Datasheet
74AHC1G08GW
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74AHC1G08GW Summary of contents
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... MM JESD22-A115-A: exceeds 200 V N CDM JESD22-C101C: exceeds 1000 V I Specified from +125 C 3. Ordering information Table 1. Ordering information Type number Package Temperature range 74AHC1G08GW +125 C 74AHCT1G08GW 74AHC1G08GV +125 C 74AHCT1G08GV Name Description TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SC-74A plastic surface-mounted package ...
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... NXP Semiconductors 4. Marking Table 2. Marking codes Type number 74AHC1G08GW 74AHC1G08GV 74AHCT1G08GW 74AHCT1G08GV 5. Functional diagram mna113 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning Fig 4. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin GND 74AHC_AHCT1G08_6 Product data sheet 74AHC1G08; 74AHCT1G08 ...
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... NXP Semiconductors 7. Functional description Table 4. Function table H = HIGH voltage level LOW voltage level Inputs Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input voltage I I input clamping current IK I output clamping current ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions For type 74AHC1G08 V HIGH-level input voltage LOW-level input voltage HIGH-level output voltage 4.0 mA 8.0 mA LOW-level output voltage 4.0 mA 8.0 mA input leakage GND ...
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... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions I supply current 5 additional per input pin supply current other inputs input I capacitance 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 3.0 ns. For test circuit see r f Symbol Parameter Conditions ...
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... NXP Semiconductors 12. Waveforms Measurement points are given in Fig 5. Input (A and B) to output (Y) propagation delays Table 9. Measurement point Type Input V I 74AHC1G08 GND to V 74AHCT1G08 GND to 3.0 V Test data is given in Table 8. Definitions for test circuit Load capacitance including jig and probe capacitance. ...
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... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 7 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 8. Package outline SOT753 (SC-74A) 74AHC_AHCT1G08_6 Product data sheet 74AHC1G08; 74AHCT1G08 scale 3.1 1.7 3.0 0.6 0.95 2 ...
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... Release date 74AHC_AHCT1G08_6 20070629 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package SOT353 changed to SOT353-1 in • ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 14 Abbreviations ...