MC14526BCP ON Semiconductor, MC14526BCP Datasheet - Page 9

• Manufacturer Part Number: MC14526BCP
• Manufacturer: ON Semiconductor
• Type: Binaryr

Specifications of MC14526BCP

• Technology: CMOS
• Number Of Elements: 1
• Number Of Bits: 4
• Logic Family: 4000
• Logical Function: Counter/Divider
• Operating Supply Voltage (typ): 3.3/5/9/12/15V
• Output Type: Standard
• Package Type: PDIP
• Propagation Delay Time: 1100ns
• Operating Temp Range: -55C to 125C
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 18V
• Operating Temperature Classification: Military
• Mounting: Through Hole
• Pin Count: 16
• Lead Free Status / Rohs Status: Not Compliant

16
1
16
1
H
−A−
0.25
G
14X
16X
M
D
e
B
T
F
D
A
9
8
16 PL
S
0.25 (0.010)
B
B
S
9
8
S
A
K
B
C
M
T
−T−
T
SEATING
PLANE
A
SEATING
PLANE
PACKAGE DIMENSIONS
M
http://onsemi.com
CASE 751G−03
J
CASE 648−08
SOIC−16WB
MC14526B
C
PDIP−16
ISSUE T
ISSUE C
9
L
q
M
NOTES:
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSIONS D AND E DO NOT INLCUDE
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
PER ASME Y14.5M, 1994.
MOLD PROTRUSION.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
A
B
C
D
G
H
K
M
F
J
L
S
DIM
A1
A
B
C
D
H
E
e
h
L
q
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
0.110
MILLIMETERS
10.15
10.05
MIN
MIN
2.35
0.10
0.35
0.23
7.40
0.25
0.50
0.100 BSC
0.050 BSC
0
1.27 BSC
INCHES
0
_
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
10.45
10.55
MAX
MAX
0.70
2.65
0.25
0.49
0.32
7.60
0.75
0.90
10
7
_
_
18.80
MILLIMETERS
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
2.54 BSC
1.27 BSC
0
_
19.55
MAX
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
10
_