ISL84051IB Intersil, ISL84051IB Datasheet - Page 17

IC MUX/DEMUX 8X1 16SOIC

ISL84051IB

Manufacturer Part Number
ISL84051IB
Description
IC MUX/DEMUX 8X1 16SOIC
Manufacturer
Intersil
Datasheet

Specifications of ISL84051IB

Function
Multiplexer/Demultiplexer
Circuit
1 x 8:1
On-state Resistance
225 Ohm
Voltage Supply Source
Single, Dual Supply
Voltage - Supply, Single/dual (±)
±2 V ~ 6 V, 2 V ~ 12 V
Current - Supply
1µA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.154", 3.90mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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Part Number
Manufacturer
Quantity
Price
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ISL84051IB
Manufacturer:
INTERSIL
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Package Outline Drawing
M16.173
16 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 5/10
6.40
4.40 ±0.10
0.20 C B A
(0.65 TYP)
2
SEATING
PLANE
(5.65)
C
0.10 C
TYPICAL RECOMMENDED LAND PATTERN
3
H
16
1
17
5.00 ±0.10
SIDE VIEW
TOP VIEW
1
0.65
- 0.05
ISL84051, ISL84052, ISL84053
3
0.25 +0.05/-0.06 5
0.10
9
8
M
(0.35 TYP)
A
I.D. MARK
C B A
PIN #1
(1.45)
1.20 MAX
B
NOTES:
1.
2.
3.
4.
5.
6.
7.
0.90 +0.15/-0.10
Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
Dimensions are measured at datum plane H.
Dimensioning and tolerancing per ASME Y14.5M-1994.
Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
is 0.07mm.
Dimension in ( ) are for reference only.
Conforms to JEDEC MO-153.
0.15 MAX
0.05 MIN
SEE DETAIL "X"
0.09-0.20
1.00 REF
DETAIL "X"
END VIEW
GAUGE
PLANE
0.60 ±0.15
0°-8°
October 8, 2010
0.25
FN6047.9

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