MAX4567CSE+ Maxim Integrated Products, MAX4567CSE+ Datasheet - Page 11

• Manufacturer Part Number: MAX4567CSE+
• Description: IC VIDEO SWITCH DUAL SPDT 16SOIC
• Manufacturer: Maxim Integrated Products

Specifications of MAX4567CSE+

• Function: Video Switch
• Circuit: 2 x SPDT
• On-state Resistance: 60 Ohm
• Voltage Supply Source: Single, Dual Supply
• Voltage - Supply, Single/dual (±): 2.7 V ~ 12 V, ± 2.7 V ~ 6 V
• Current - Supply: 1µA
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• On Resistance (max): 350 Ohms at 2.7 V
• On Time (max): 500 ns at 2.7 V
• Off Time (max): 120 ns at 5 V
• Supply Voltage (max): 12 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Maximum Power Dissipation: 696 mW
• Switch Configuration: SPDT
• Switch Current (typ): 0.00005 mA at 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 2. 4-Channel Multiplexer
The MAX4567 has two V+ and two V- pins. Make DC
connections to only one of each to minimize crosstalk.
Do not route DC current into one of the V+ or V- pins
and out the other V+ or V- pin to other devices. The
second set of V+ and V- pins is for AC bypassing only.
For dual-supply operation, the MAX4567 should have
four 10nF bypass capacitors connected to each V+
and V- pin as close to the package as possible. For sin-
gle-supply operation, the MAX4567 should have two
10nF bypass capacitors connected (one to each V+
pin) as close to the package as possible.
On the MAX4565, GND5 and GND6 should always be
connected to the ground plane with solid copper to
improve isolation and crosstalk.
50/75
OUT/IN
IN1
IN2
IN3
IN4
______________________________________________________________________________________
GND5
GND6
COM1
GND1
GND2
COM3
GND3
COM4
GND4
IN1
IN2
IN3
IN4
COM2
10nF
10nF
MAX4565
V-
V-
V+
V+
NO1
NO2
NO3
NO4
Bidirectional RF/Video Switches
50/75
OUT/IN
1
3
DECODING
5
7
ADDRESS
2
6
4
8
Quad/Dual, Low-Voltage,
Keep all signal leads as short as possible. Separate all
signal leads from each other and other traces with the
ground plane on both sides of the board. Where possible,
use coaxial cable instead of printed circuit board traces.
IC sockets degrade high-frequency performance and
should not be used if signal bandwidth exceeds 5MHz.
Surface-mount parts, having shorter internal lead
frames, provide the best high-frequency performance.
Keep all bypass capacitors close to the device, and
separate all signal leads with ground planes. Such
grounds tend to be wedge-shaped as they get closer to
the device. Use vias to connect the ground planes on
each side of the board, and place the vias in the apex of
the wedge-shaped grounds that separate signal leads.
Logic-level signal lead placement is not critical.
1
2
3
4
1
2
3
4
MAX4565
MAX4565
OUT
OUT
ADDITIONAL
MUXES
TO
1
2
3
4
MAX4565
Signal Routing
Board Layout
OUT
11