PEMI6CSP/RW,135 NXP Semiconductors, PEMI6CSP/RW,135 Datasheet
PEMI6CSP/RW,135
Specifications of PEMI6CSP/RW,135
Related parts for PEMI6CSP/RW,135
PEMI6CSP/RW,135 Summary of contents
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... Rev. 1 — 3 February 2011 1. Product profile 1.1 General description The devices are a family of 4-, 6- and 8-channel RC low pass filters which are designed to provide filtering of undesired RF signals on the I/O ports of portable communication or computing devices. In addition the devices incorporate diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages up to ±20 kV. ...
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... NXP Semiconductors 2. Pinning information 2.1 Pinning bump A1 index area transparent top view, solder balls facing down Fig 1. PEMI4CSP: pin configuration Fig 3. PEMI8CSP: pin configuration 2.2 Pin description Table 1. Pin PEMI4CSP A1 and C1 A2 and C2 A3 and C3 A4 and and B2 PEMIXCSP_FAM Product data sheet ...
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... NXP Semiconductors 3. Ordering information Table 2. Ordering information Type number Package Name WLCSP10 wafer level chip-size package; 10 bumps; 1.56 × 1.05 × 0.61 mm PEMI4CSP/RT WLCSP10 wafer level chip-size package; 10 bumps; 1.56 × 1.05 × 0.61 mm PEMI4CSP/RW WLCSP15 wafer level chip-size package; 15 bumps; 2.36 × 1.05 × 0.61 mm PEMI6CSP/RT WLCSP15 wafer level chip-size package ...
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... NXP Semiconductors 5. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ESD tot T stg T amb Device is qualified with 1000 pulses of ±15 kV contact discharges each, according to the IEC 61000-4-2 [1] model and far exceeds the specified level contact discharge). ...
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... NXP Semiconductors Table amb Symbol Parameter α il α −3dB 7. Application information 7.1 Insertion loss The devices are designed as EMI/RFI filters for multichannel interfaces. All measurements were performed in a typical 50 Ω NetWork Analyzer (NWA) setup as shown in Fig 7. PEMIXCSP_FAM Product data sheet 4-, 6- and 8-channel passive filter network with ESD protection Frequency characteristics ° ...
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... NXP Semiconductors (1) PEMIxCSP/RT (2) PEMIxCSP/RW Fig 8. 7.2 Use cases The selection of one of the filter device has to be performed in dependence of the maximum clock frequency, the driver strength, the capacitive load of the sink and the maximum applicable rise and fall times. 7.3 LCD interfaces, medium-speed interfaces ...
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... NXP Semiconductors 8. Marking All dies are laser-marked with the following information (see • A marker indicating the pin A1 position. • Two lines of characters or numbers: – The first line (placeholder <marking code>) indicates the marking code. Mapping of product type numbers to marking codes is given in – ...
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... NXP Semiconductors 9. Package outline WLCSP10: wafer level chip-size package; 10 bumps (4-2-4) bump A1 index area European projection Fig 11. Package outline PEMI4CSP (WLCSP10) Table 7. Package outline dimensions of PEMI4CSP Symbol Min A 0. 0.21 D 1. PEMIXCSP_FAM Product data sheet 4-, 6- and 8-channel passive filter network with ESD protection ...
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... NXP Semiconductors WLCSP15: wafer level chip-size package; 15 bumps (6-3-6) bump A1 index area European projection Fig 12. Package outline PEMI6CSP (WLCSP15) Table 8. Package outline dimensions of PEMI6CSP Symbol Min A 0. 0.21 D 2. PEMIXCSP_FAM Product data sheet 4-, 6- and 8-channel passive filter network with ESD protection ...
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... NXP Semiconductors WLCSP20: wafer level chip-size package; 20 bumps (8-4-8) bump A1 index area European projection Fig 13. Package outline PEMI8CSP (WLCSP20) Table 9. Package outline dimensions of PEMI8CSP Symbol Min A 0. 0.21 D 3. PEMIXCSP_FAM Product data sheet 4-, 6- and 8-channel passive filter network with ESD protection ...
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... NXP Semiconductors 10. Design and assembly recommendations 10.1 PCB design guidelines It is recommended, for optimum performance, to use a Non-Solder Mask Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance ...
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... NXP Semiconductors Fig 14. Pb-free solder reflow profile Table 12. Symbol T reflow(peak dT/dt PEMIXCSP_FAM Product data sheet 4-, 6- and 8-channel passive filter network with ESD protection T (°C) T reflow(peak) 250 230 217 preheat t 1 The device is capable of withstanding at least three reflows of this profile. Characteristics ...
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... NXP Semiconductors 11. Revision history Table 13. Revision history Document ID Release date PEMIXCSP_FAM v.1 20110203 PEMIXCSP_FAM Product data sheet 4-, 6- and 8-channel passive filter network with ESD protection Data sheet status Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 February 2011 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... ESD protection NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information 7.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 Use cases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7 ...