L3845B STMicroelectronics, L3845B Datasheet - Page 2

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L3845B

Manufacturer Part Number
L3845B
Description
IC TRUNK INTERFACE 8-MINIDIP
Manufacturer
STMicroelectronics
Datasheet

Specifications of L3845B

Applications
Monitoring, Digital Current
Package / Case
8-DIP (0.300", 7.62mm)
Mounting Type
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Supply
-
Interface
-
Other names
497-3625

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L3845
ABSOLUTE MAXIMUM RATINGS
PIN CONNECTION (Top view)
THERMAL DATA
(*) Mounted on FR4 Boards
2/8
SUBS = the pin is electrically and thermally in good contact with the chip sustrate. Connect to PCB copper tracks, for heat dissipation the
Symbol
Symbol
R
T
srg
th j-amb
P
T
V
I
L
tot
op
, T
L
tracks shall preferably be electrically connected to pin 20 (internally bonded to the chip substrate) or left floating. A higher track
density and/or area assures a R
j
PULSE
SUBS
SUBS
SUBS
SUBS
DCT
HD0
ACT
NC
NC
Max Line Voltage (pulse duration 10 ms max)
Max Line Current
Total Power Dissipation at Tamb = 70 C
Operating Temperature
Storage and Junction Temperature
Thermal Resistance Junction-ambient (*)
1
2
3
4
5
6
7
8
9
10
SO20
SO20
th j-amb
Parameter
towards the lower limit.
20
19
18
17
16
15
14
13
12
11
Parameter
V-
IN1
NC
SUBS
SUBS
SUBS
SUBS
NC
V+
IN2
Max.
PULSE
HD0
Minidip
IN1
V-
80
MINIDIP and SO8
1
2
3
4
140 to 180
DIP8
SO8
– 55 to + 150
– 40 to + 70
Value
150
800
20
8
7
6
5
50 to 70
SO20
V+
IN2
DCT
ACT
Unit
Unit
mW
mA
C/W
V
C
C

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