CC-9P-V526UJ-S Digi International, CC-9P-V526UJ-S Datasheet - Page 90

• Manufacturer Part Number: CC-9P-V526UJ-S
• Description: MOD 9P 32MB SDRAM 8MB FLASH
• Manufacturer: Digi International
• Series: -r

Specifications of CC-9P-V526UJ-S

• Module/board Type: Core Module
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: Networking

Additional design
recommendations
www.digiembedded.com
When attaching thermocouples, please the follow the guidelines below:
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The following list provides additional design guidance with respect to thermal
management in applications with operating temperatures at the high end or beyond
the specified standard ambient temperature range.
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Carefully remove any labels or other foreign material from the component.
Ensure an adhesive with high thermal conductivity is used. Use as little
adhesive as possible.
Make sure the thermocouple is touching the case of the component and not
"floating" in the adhesive.
The use of precision, fine-wire K-type thermocouples is strongly recommended
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Providing air movement will improve heat dissipation.
The host PCB plays a large part in dissipating the heat generated by the
module. A large copper plane located will improve the heat dissipation
capabilities of the PCB.
If the design allows, added buried PCB planes will also improve heat
dissipation. The copper planes create a larger surface to spread the heat into
the surrounding environment.
Omega Engineering P/N 5TC-TT-K-36-72, or similar
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