MCP23S08-E/P Microchip Technology, MCP23S08-E/P Datasheet - Page 39

• Manufacturer Part Number: MCP23S08-E/P
• Description: IC I/O EXPANDER SPI 8B 18DIP
• Manufacturer: Microchip Technology

Specifications of MCP23S08-E/P

• Package / Case: 18-DIP (0.300", 7.62mm)
• Interface: SPI
• Number Of I /o: 8
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Includes: POR
• Logic Family: MCP23S08
• Propagation Delay Time: 50 ns
• Operating Supply Voltage: 1.8 V to 5.5 V
• Power Dissipation: 700 mW
• Operating Temperature Range: - 40 C to + 125 C
• Input Voltage: 1.8 V to 5.5 V
• Logic Type: I/O Expander
• Maximum Clock Frequency: 10 MHz
• Maximum Operating Frequency: 1.7 MHz
• Mounting Style: Through Hole
• Output Current: 25 mA
• Output Voltage: 1.8 V to 4.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX A:
Revision E (August 2007)
1.
Revision D (February 2007)
1.
2.
3.
4.
Revision C (October 2006)
1.
2.
Revision B (February 2005)
The following is the list of modifications:
1.
2.
Revision A (December 2004)
• Original Release of this Document.
© 2007 Microchip Technology Inc.
Section 3.0
Updated package outline drawings.
Changed
Figure 1-1 from “R” to “W”.
Table 2-4, Param No. 51 and 53: Changed from
450 to 600 and 500 to 600, respecively.
Added disclaimer to package outline drawings.
Updated package outline drawings.
Added
throughout document.
Added disclaimer to package outline drawings.
Section 1.6 “Configuration and Control Reg-
isters”. Added Hardware Address Enable
(HAEN) bit to Table 1-3.
Section 1.6.6 “Configuration (IOCON) Regis-
ter”. Added Hardware Address Enable (HAEN)
bit to Register 1-6.
20-pin
Byte
“Packaging
QFN
REVISION HISTORY
and
Sequential
package
Information”:
information
Read
in
MCP23008/MCP23S08
DS21919E-page 39