MCP23S08-E/SO Microchip Technology, MCP23S08-E/SO Datasheet - Page 32

IC I/O EXPANDER SPI 8B 18SOIC

MCP23S08-E/SO

Manufacturer Part Number
MCP23S08-E/SO
Description
IC I/O EXPANDER SPI 8B 18SOIC
Manufacturer
Microchip Technology
Datasheets

Specifications of MCP23S08-E/SO

Package / Case
18-SOIC (7.5mm Width)
Interface
SPI
Number Of I /o
8
Interrupt Output
Yes
Frequency - Clock
10MHz
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Includes
POR
Logic Family
MCP23S08
Propagation Delay Time
50 ns
Operating Supply Voltage
1.8 V to 5.5 V
Power Dissipation
700 mW
Operating Temperature Range
- 40 C to + 125 C
Input Voltage
1.8 V to 5.5 V
Logic Type
I/O Expander
Maximum Clock Frequency
10 MHz
Maximum Operating Frequency
1.7 MHz
Mounting Style
SMD/SMT
Output Current
25 mA
Output Voltage
1.8 V to 4.5 V
Chip Configuration
8 Bit
Bus Frequency
10MHz
Ic Interface Type
Serial, SPI
No. Of I/o's
8
Supply Voltage Range
1.8V To 5.5V
Digital Ic Case Style
SOIC
No. Of Pins
18
Filter Terminals
SMD
Rohs Compliant
Yes
Delay Time
50ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP23S08-E/SO
Manufacturer:
HIMAX
Quantity:
1 450
Part Number:
MCP23S08-E/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP23008/MCP23S08
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS21919B-page 32
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
E1
E
eB
Dimension Limits
2
1
§
c
D
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
MIN
A1
A
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
© 2005 Microchip Technology Inc.
NOM
p
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
18
10
10
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15

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