TDA8395 NXP Semiconductors, TDA8395 Datasheet - Page 9

• Manufacturer Part Number: TDA8395
• Manufacturer: NXP Semiconductors

Specifications of TDA8395

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Philips Semiconductors
PACKAGE OUTLINE
October 1991
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SECAM decoder
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
OUTLINE
VERSION
SOT38-1
max.
0.19
4.7
L
A
Z
0.020
min.
0.51
16
A
1
1
050G09
IEC
pin 1 index
max.
0.15
3.7
A
2
0.055
0.045
1.40
1.14
b
e
MO-001AE
0.021
0.015
0.53
0.38
JEDEC
b
D
1
REFERENCES
0
0.013
0.009
0.32
0.23
c
b
21.8
21.4
0.86
0.84
D
(1)
scale
EIAJ
5
9
6.48
6.20
0.26
0.24
E
b
9
8
(1)
1
2.54
0.10
w
A
e
10 mm
1
M
A
E
2
7.62
0.30
e
1
A
0.15
0.13
3.9
3.4
L
PROJECTION
EUROPEAN
c
8.25
7.80
0.32
0.31
M
E
(e )
M
M
Preliminary specification
H
1
E
0.37
0.33
M
9.5
8.3
H
TDA8395
ISSUE DATE
0.254
0.01
92-10-02
95-01-19
w
SOT38-1
0.087
max.
2.2
Z
(1)